Senior Package Tech Lead: Automotive Power Modules

Infineon Technologies; Ipoh; On-site; MYR 364,000 - 486,000; Full time

Job summary

A global semiconductor leader is looking for a seasoned professional to support TPAK/IDPAK platform projects. This role involves designing power package technologies while providing technical guidance and leadership to partners. Candidates should have over 10 years of experience in package development and project management, with strong knowledge in Automotive quality standards. This position offers the chance to innovate in a diverse and inclusive environment that prioritizes decarbonization and digitalization.

Qualifications

• 10+ years of experience in package development and project management, focusing on New Product Introduction.
• Strong technical knowledge of Back End processes and materials.
• Good understanding of Automotive quality and reliability standards.

Responsibilities

• Design and develop power module and package technologies.
• Provide technical guidance for package technology development.
• Drive technical decision-making for new package technologies.

Skills

Package Design and Development

Technical Advisor

Project Management

Problem-Solving and Analysis

Automotive quality knowledge

Education

Bachelor's or Master's degree in Materials Science or Engineering

Job description

A global semiconductor leader is looking for a seasoned professional to support TPAK/IDPAK platform projects. This role involves designing power package technologies while providing technical guidance and leadership to partners. Candidates should have over 10 years of experience in package development and project management, with strong knowledge in Automotive quality standards. This position offers the chance to innovate in a diverse and inclusive environment that prioritizes decarbonization and digitalization.