Senior Engineer Development

Infineon Technologies; Malacca City; On-site; MYR 60,000 - 80,000; Full time

Job summary

A global leader in semiconductor solutions is seeking a skilled engineer to perform design and specification for lead frames and packing materials. The ideal candidate should have a Bachelor's Degree in Engineering and at least 3 years of experience in semiconductor assembly and packaging development. Responsibilities include driving development activities and collaborating with suppliers to ensure quality. This position is based in Malacca, Malaysia, and offers a dynamic work environment focused on innovation and diversity.

Qualifications

• 3 years of working experience in semiconductor assembly and packaging development.
• Experience in Lead Frame/Packing Material development.
• Knowledge of GD&T and material properties.

Responsibilities

• Perform design for lead frame based on guidelines.
• Collaborate on packing material design.
• Drive development activities and ensure project milestones.

Skills

Lead Frame design

Material physics knowledge

Analytical skills

Problem solving skills

Education

Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics)

Tools

AutoCAD

Inventor

Job description

Your Role

• Perform design, drawing and specification for lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
• Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.
• Drive lead frame / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM).
• Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame / packing material; and qualification release.
• Establish design guideline / requirement for lead frame / packing material specification.
• Generate technical papers / journals and patents related to lead frame design / package design that enhances technical value.

Your Profile

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 3 years of working experience in semiconductor assembly and packaging development; and relevance experience in Lead Frame / Packing Material is preferred.
• Lead Frame design / packing material development & qualification.
• Drafting / designing (2D/3D) Lead Frame using AutoCAD / Inventor.
• Knowledge in material physics / properties for Lead Frame and packing material.
• GD&T knowledge / material specification definition.
• Analytical and problem solving skills.

Contact

[e-mail]

About Infineon

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals.

Diversity & Inclusion

We embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant’s experience and skills.

Next Steps

We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.