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Packaging Module Development Engineer

Intel

Kulim

On-site

MYR 150,000 - 200,000

Full time

Yesterday
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Job summary

A leading semiconductor company in Kulim, Malaysia is seeking a Process Development Engineer to focus on developing and optimizing manufacturing processes for cutting-edge technologies. The ideal candidate will hold an MSc/MEng/BEng degree, preferably with some experience in Research and Development. Responsibilities include collaborating with cross-functional teams and qualifying materials for high-volume production. This position emphasizes strong data analysis and problem-solving skills, alongside effective communication capabilities.

Qualifications

  • MSc/MEng/BEng degree in Mechanical, Materials, Chemical, Electrical, Physics or Mechatronics.
  • Research and Development experience is preferred.
  • Collegiate Graduate or less than 1 year of experience preferred.
  • Understanding of semiconductor assembly equipment and processes.
  • Excellent communication skills in written and verbal formats.

Responsibilities

  • Focus on Process and Technology Development for New Product.
  • Develop and qualify materials to high volume manufacturing.
  • Optimize efficiency of package manufacturing processes.
  • Collaborate with cross-functional teams on material technologies.

Skills

Data analysis
Problem-solving
Communication skills
Influencing skills
Proactivity

Education

MSc/MEng/BEng degree in relevant engineering disciplines
Research and Development background
Job description
Job Details

Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization

CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process

Candidate will focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and Foundry Product.

Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization

Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.

Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.

Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.

Collaborating closely with other cross‑functional team to build material technologies on test vehicles and products and assessing their performance.

Qualifications
  • MSc/MEng/BEng degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics)
  • Research and Development background from MSc is preferred
  • Collegiate Graduate is preferred or less than 1 year experience
  • Fundamental understanding of semiconductor assembly equipment and process
  • Excellent influencing, written and verbal communication skills
  • Strong data analysis capabilities and problem‑solving skills
  • Proactive and positive approach towards challenges
  • Able to work under tight timelines and schedules, and perform under pressure
Job Type

College Grad

Shift

Shift 1 (Malaysia)

Primary Location

Malaysia, Kulim

Additional Locations
Business Group

Intel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers – from delivering cutting‑edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on‑site presence. Job posting details (such as work model, location or time type) are subject to change.

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