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A leading semiconductor company in Malaysia is looking for a Maintenance Engineer to perform preventive and corrective maintenance on equipment. You will troubleshoot mechanical, electrical, and software issues, and provide technical support to production teams. The ideal candidate will have a Bachelor's degree in Engineering, at least 3 years of experience in semiconductor equipment maintenance, and strong problem-solving abilities. Join us to enhance equipment efficiency and reliability while ensuring safety and compliance.
Perform routine preventive and corrective maintenance on DieSaw, Package Saw, WBG/Mounter, AOI (Wafer , QPanel, Panel process) equipment to ensure optimal performance and minimize downtime.
Troubleshoot and resolve equipment issues, including mechanical, electrical, and software problems.
Maintain accurate maintenance records and documentation.
Provide technical support to production teams to resolve equipment-related issues and minimize disruptions.
Collaborate with engineering and production teams to implement equipment upgrades and modifications.
Analyze equipment performance data to identify areas for improvement.
Develop and implement process improvements and maintenance strategies to enhance equipment efficiency and reliability.
Adhere to safety protocols and ensure compliance with industry regulations and standards.
Conduct safety inspections and risk assessments to maintain a safe working environment.
Train and mentor junior maintenance staff and production operators on equipment operation and maintenance procedures.
Stay updated with the latest advancements in DieSaw, Package Saw, WBG/Mounter and AOI technology and maintenance practices.
Bachelor’s degree in Mechanical Engineering, Electrical, Electronics Engineering, or a related field, or equivalent technical certification.
Minimum of 3 years of experience in maintenance engineering, with a focus on DieSaw, Package Saw, WBG/Mounter, AOI (Wafer, Qpanel, Panel process) or similar semiconductor manufacturing equipment.
Proficiency in the operation and maintenance of DieSaw, Package Saw, WBG/Mounter, AOI (Wafer, Qpanel, Panel process) equipment.
Strong understanding of mechanical, electrical, and software systems.
Experience with diagnostic tools and maintenance management software.
Strong problem-solving abilities and attention to detail.
Excellent communication skills and the ability to work collaboratively in a team environment.
Ability to manage multiple tasks and prioritize effectively.
Experience with specific DieSaw, Package Saw & WBG/Mounter systems such as Disco.
Experience with AOI system such as Camtek, KLA, and Pentamaster
Knowledge of semiconductor manufacturing processes and industry standards.
Certifications related to equipment maintenance or semiconductor manufacturing.