Lead Wire Bond Equipment & Process Engineer

Nexperia Malaysia Sdn.Bhd.; Seremban; On-site; MYR 80,000 - 100,000; Full time

Job summary

A global semiconductor manufacturer is seeking a Senior Wire Bond Equipment & Process Engineer in Malaysia. The candidate will optimize semiconductor manufacturing processes, lead equipment setup and qualification, and develop process improvements. The role requires a Bachelor's in Engineering, with a minimum of 5 years' experience in wire bonding. Strong analytical skills and knowledge of bonding techniques are essential. This position offers an inclusive work environment with opportunities for professional growth.

Benefits

Inclusive work environment

Employee resource groups

Commitment to diversity in leadership

Qualifications

• Minimum 5 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques.
• Solid analytical and problem-solving skills with data-driven decision making.

Responsibilities

• Lead the setup and optimization of wire bonding equipment and processes.
• Develop process improvements to enhance yield and reliability.
• Troubleshoot and resolve equipment and process issues.

Skills

Wire bonding techniques

Process optimization

Statistical tools

Analytical skills

Communication skills

Education

Bachelor’s degree in Engineering

Tools

JMP

Minitab

ASM wire bonders

Job description

A global semiconductor manufacturer is seeking a Senior Wire Bond Equipment & Process Engineer in Malaysia. The candidate will optimize semiconductor manufacturing processes, lead equipment setup and qualification, and develop process improvements. The role requires a Bachelor's in Engineering, with a minimum of 5 years' experience in wire bonding. Strong analytical skills and knowledge of bonding techniques are essential. This position offers an inclusive work environment with opportunities for professional growth.