IC Package Design Engineer — High-Density Routing Expert

UST Global; Penang; On-site; MYR 70,000 - 90,000; Full time

Job summary

A leading technology firm is seeking an IC Package Design Engineer in Penang. The role involves executing high density package layout designs, managing routing feasibility studies, and conducting design rule checks using Mentor Graphics Xpedition PCB software. Candidates should have a Bachelor or Master in Electrical/Electronics Engineering with at least 3 years of experience in relevant fields, and effective communication skills in English are essential. It’s advantageous to have knowledge in DDR/PCIe/SERDES interfaces and electromagnetic theories.

Qualifications

• 3+ years of experience in related fields.
• Experience in Package/Board CAD layout design.

Responsibilities

• Conduct routing feasibility studies.
• Perform signal breakout & full path routing.
• Manage design rule checks (DRCs) and cleanup.

Skills

Signal breakout & full path routing

Power routing

Route feasibility studies

Design rule checks (DRCs)

Communication in English

Time and task management

Education

Bachelor or Master in Electrical/Electronics Engineering

Tools

Mentor Graphics Xpedition PCB

Job description

A leading technology firm is seeking an IC Package Design Engineer in Penang. The role involves executing high density package layout designs, managing routing feasibility studies, and conducting design rule checks using Mentor Graphics Xpedition PCB software. Candidates should have a Bachelor or Master in Electrical/Electronics Engineering with at least 3 years of experience in relevant fields, and effective communication skills in English are essential. It’s advantageous to have knowledge in DDR/PCIe/SERDES interfaces and electromagnetic theories.