Graduate Process Engineer

Renesas Electronics; Bayan Lepas; On-site; MYR 48,000 - 60,000; Full time

Job summary

A leading semiconductor company in Bayan Lepas is seeking a Die Bond & Wire Bond Engineer. This role is ideal for fresh graduates passionate about process improvement and eager to learn. Responsibilities include supporting the development of die bond and wire bond processes, troubleshooting issues, and participating in new product introductions. Candidates should have a Bachelor’s degree in Engineering, with knowledge of semiconductor processes being advantageous. Join a dynamic team and enhance your skills in a supportive environment.

Qualifications

• Fresh graduates with a Bachelor’s degree in Engineering.
• Knowledge of QFN or similar semiconductor packages is a plus.
• Basic knowledge of die bonding and wire bonding processes is advantageous.

Responsibilities

• Support development and maintenance of die bond and wire bond processes.
• Assist in troubleshooting process issues and perform root cause analysis.
• Participate in new product introduction and transition to mass production.

Skills

Problem-solving skills

Interest in yield improvement

Strong willingness to learn

Education

Bachelor’s degree in Engineering (Materials, Mechanical, Manufacturing)

Tools

Basic programming knowledge in C, C++ or Python

Job description

Job Description

As a Die Bond & Wire Bond Engineer, you will be part of a dynamic manufacturing team, supporting semiconductor assembly processes from development to mass production. This role is ideal for fresh graduates who are eager to learn, hands‑on, and passionate about process improvement.

Responsibilities

• Support the development, optimization, and maintenance of die bond and wire bond processes to ensure good quality, yield, and reliability.
• Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment‑related problems.
• Participate in new product introduction (NPI), process qualification, and transition to mass production.
• Help establish and update process parameters, work instructions, and control plans.
• Analyze process data using basic statistical tools such as SPC, CPK, and trend analysis.
• Work closely with cross‑functional teams including Production, Quality, Equipment, and R&D.
• Contribute to continuous improvement initiatives to enhance yield, cost efficiency, cycle time, and product reliability.

Qualifications

• Fresh graduates with a Bachelor’s degree in Engineering (Materials, Mechanical, Manufacturing, or related fields).
• Basic knowledge or exposure to die bonding and wire bonding processes is an added advantage.
• Knowledge of QFN (Quad Flat No‑Lead) or similar semiconductor packages is a plus.
• Knowledge of DOE (Design of Experiments) methods is a plus.
• Interest in yield improvement, reliability testing, and failure analysis.
• Exposure to automation, equipment setup, or process optimization through academic projects or internships is beneficial.
• Basic programming knowledge in C, C++ or Python is an added advantage.
• Strong willingness to learn, good problem‑solving skills, and a positive teamwork attitude.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.