Engineer Unit Process Engineering Die Bond

Infineon Technologies; Malacca City; On-site; MYR 60,000 - 80,000; Full time

Job summary

A global semiconductor leader in Malaysia is seeking a Die Bond expert responsible for achieving robust and auto-pilot processes. Key responsibilities include supporting new technology development, driving closure of 8D processes, and leading quality improvement activities. Candidates should have a Bachelor's or Master's degree in a relevant engineering field and over 2 years of experience in FOL Process Engineering or Semiconductor Assembly. Join us and contribute to innovative solutions for a greener technology future.

Qualifications

• More than 2 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.

Responsibilities

• Supports development of new technologies and ensures smooth take-over into volume production.
• Accountable and drive for 8D closure of FAR, MRB, DDM, LOH and SDCAR.
• Leading and participating in yield & quality improvement.

Skills

Process & product control

Productivity/process improvement

First level reliability

Die Bond Process

Education

Bachelor's or Master degree in Mechanical, Manufacturing, Electronics or related Engineering

Job description

Die Bond expert, responsible to achieve robust and auto-pilot processes.

Your Role

Key responsibilities in your new role

• Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
• Accountable and drive for 8D closure of FAR, MRB, DDM, LOH and SDCAR.
• Leading and participating in yield & quality improvement and cost reduction activities.
• As a technical expert in new material, process and method qualification.
• Provide technical consultation and guidance team to ensure team success in daily tasks and projects.
• Support on auditing activities.

Your Profile

• Bachelor's or Master degree in Mechanical, Manufacturing, Electronics or related Engineering.
• More than 2 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.
• Die Bond Process.
• Process & product control.
• Productivity/process improvement.
• First level reliability (Knowledge of various failure modes, knowledge of application and respective reliability requirements and test standards).

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.