Die Attach Process Engineer

STMicroelectronics; Johor; On-site; MYR 150,000 - 200,000; Full time

Job summary

A global semiconductor company located in Malaysia is seeking a skilled individual to lead process optimization in die bonding. The ideal candidate should hold a Bachelor's or Master's degree in Engineering and demonstrate strong analytical and collaborative skills. Responsibilities include troubleshooting production issues, optimizing process performance, and developing camera vision parameters. This position requires excellent English communication skills and proficiency in MS Office applications, providing opportunities for growth in a diverse workplace.

Qualifications

• Bachelor’s or master's degree is essential.
• Strong proficiency in MS Excel and Office applications is necessary.
• Demonstrated ability to manage multiple tasks in a fast-paced environment.

Responsibilities

• Lead process optimization for die bonding.
• Troubleshoot die attach line issues and implement solutions.
• Develop camera vision parameters for process quality.

Skills

Analytical skills

Team collaboration

Task management

Education

Bachelor’s or Master’s degree in Engineering (Electrical, Mechanical, Material Engineering)

Tools

MS Excel

Microsoft Office

PowerPoint

Job description

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

• Lead for process optimization and improvement for die bonding process.
• Perform die attach related line issue troubleshooting and failure analysis, implement corrective actions to enhance machine stability and reliability.
• Develop and fine tune camera vision parameters to ensure optimal process performance, quality, and yield.
• Work as team between Operation /Equipment &Quality Team to resolve daily production issue & reduce production line disruption
• Performance FMEA, Risk Assessment of process change with proper change management process

YOUR SKILLS & EXPERIENCES

• Bachelor’s or master's degree in engineering (Electrical, Mechanical, Material Engineering or related field).
• Highly organized, proactive, and solution-oriented individual with strong analytical skills.
• Demonstrated ability to manage multiple tasks effectively in a fast-paced, dynamic environment.
• Strong team player with the ability to collaborate across functions while working independently when required.
• Excellent command of English (both spoken and written), with strong communication and reporting skills.
• Strong proficiency in MS Excel, Office, Power Point applications for tracking and analyzing operational data.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.