Advanced Packaging Process Engineer

Michael Page; Malacca City; On-site; MYR 60,000 - 100,000; Full time

Job summary

This innovative firm is seeking a seasoned professional in the semiconductor industry to optimize and manage high-speed process parameters for component attachment. The role involves collaborating with factory operations to achieve quality standards and cost targets while driving advancements in power module packaging. With a strong focus on project management and technical expertise in QFN packages, this position offers a competitive salary and long-term career development opportunities. Join a market leader in the semiconductor world and make a significant impact in a growing and expanding organization.

Benefits

Attractive Benefits

Long-term Career Development Plans

Great Salary Package

Qualifications

• Minimum 8 years of semiconductor experience required.
• Hands-on experience with component attachment equipment is essential.

Responsibilities

• Optimize high-speed process parameters for component attachment.
• Manage new product executions from prototyping to RTM.
• Collaborate with operations to meet quality and cost targets.

Skills

Project Management

Technical Understanding of QFN Packages

Experience with SMT Technologies

Process Optimization

Collaboration with Operations Teams

Education

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Physics

Bachelor's degree in Material Science

Tools

Flip-Chip Equipment

Chip Shooter Equipment

Job description

• Growing and Expanding organisation
• Attractive Benefits

About Our Client

Our client is a renowned semiconductor player expanding their footprint in Malaysia.

Job Description

1. Optimizing and establishing robust, high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology.
2. Defining simplified manufacturing process sequences for different component attachment methods.
3. Managing multiple new product executions from kick-off, product prototyping, characterization, learning cycles, and qualifications through to RTM, including project documentation.
4. Collaborating closely with factory operations teams to meet manufacturing indices, quality standards, and cost targets.
5. Engaging with global package platform and emerging technology teams to execute differentiated technology roadmaps and establish process capabilities proactively.
6. Driving power module package competitiveness by adopting the latest industry advancements in high-volume manufacturing.

The Successful Applicant

1. Bachelor's degree in Mechanical Engineering, Physics, Material Science, or a related field.
2. Minimum 8 years of experience in the semiconductor field.
3. Experience with SMT and leaded module technologies.
4. Broad and deep technical understanding of QFN packages integrated with wire bond interconnect, flip-chip interconnect, passive component, and inductor integration.
5. Project management experience in the semiconductor industry, specifically in Assembly Test or SMT operations.
6. Experience with assembly of power module packaging, substrate design, and reliability requirements.
7. Hands-on experience with flip-chip, chip shooter, or other component attachment equipment (for resistors, capacitors, inductors, clips).

What's on Offer

1. Great salary package and long term career development plans.
2. Being part of a market leader in the semiconductor world.