Packaging jobs in Canada
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UCIe Die-to-Die Project Lead
Job summary
A leading technology company is looking for an experienced engineering leader to drive innovations in UCIe die-to-die interfaces and advanced packaging. You will manage complex projects, lead cross-functional teams, and enhance collaboration to deliver high-performance chiplet-based systems. The role requires strong expertise in semiconductor design and excellent communication skills. Join a multidisciplinary engineering team that values innovation and inclusion based in Ottawa or Toronto.
Benefits
Qualifications
- Experience in semiconductor or high-tech fields.
- Proven track record in managing complex projects.
- Ability to coordinate cross-functional teams effectively.
Responsibilities
- Lead UCIe die-to-die interface projects from concept to delivery.
- Oversee technical reviews and quality assurance processes.
- Mentor and support junior engineers.
Skills
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.