Staff Engineer Failure Analysis

Infineon Technologies; Bayan Lepas; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading semiconductor firm located in Penang is seeking an experienced failure analyst. You will perform full physical failure analysis on various devices, liaise with engineering teams, and spearhead new analysis techniques. The ideal candidate has a Bachelor's in a relevant engineering field and 6-10 years of experience in IC failure analysis. Familiarity with advanced tools like FESEM and FIB is essential, and knowledge in AI is a plus. This role offers an opportunity to contribute effectively to innovative projects.

Qualifications

• Minimum 6-10 years’ experience in silicon level failure analysis on IC failure.
• Familiarity on Bench test setup and verification.
• Knowledge in Artificial Intelligence would be added advantage.

Responsibilities

• Perform full physical failure analysis on Memory, IoT, USB and Microcontroller.
• Liaise with relevant engineering groups on analysis and corrective actions.
• Spearhead development of new analysis techniques.

Skills

Silicon level failure analysis

Knowledge of semiconductor physics

Familiarity with fault isolation techniques

Proficiency in operating advanced failure analysis tools

Education

Bachelor in Electronics/Electrical/Microelectronics/Material Engineering, Material Science, Physics or Chemistry

Tools

FESEM

FIB

Nano-probing

Job description

Perform full physical failure analysis on Memory, IoT, USB and Microcontroller, and write failure analysis report.

Liaise with relevant engineering groups on analysis and corrective actions.

Spearhead development of new analysis techniques to meet technology and device challenges.

Take ownership of certain tools and equipment.

Requirements:

Bachelor in Electronics/Electrical/Microelectronics/Material Engineering, Material Science, Physics or Chemistry.

Minimum 6-10 years’ experience in silicon level failure analysis on IC failure.

Preferable with knowledge related to semiconductor and physics.

Familiarity on Bench test setup and verification, fault isolation equipment/technique such as OBIRCH, Photon and Thermal emission.

Familiarity in die deprocessing and proficiency in operating advance failure analysis tools (e.g. FESEM, FIB, nano-probing) and knowledge in Artificial Intelligence (Ai) would be added advantage.