Senior & Staff Wire Bond Equipment & Process Engineer

Nexperia Malaysia Sdn.Bhd.; Seremban; On-site; MYR 80,000 - 100,000; Full time

Job summary

A global semiconductor manufacturer is seeking a Senior Wire Bond Equipment & Process Engineer in Malaysia. The candidate will optimize semiconductor manufacturing processes, lead equipment setup and qualification, and develop process improvements. The role requires a Bachelor's in Engineering, with a minimum of 5 years' experience in wire bonding. Strong analytical skills and knowledge of bonding techniques are essential. This position offers an inclusive work environment with opportunities for professional growth.

Benefits

Inclusive work environment

Employee resource groups

Commitment to diversity in leadership

Qualifications

• Minimum 5 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques.
• Solid analytical and problem-solving skills with data-driven decision making.

Responsibilities

• Lead the setup and optimization of wire bonding equipment and processes.
• Develop process improvements to enhance yield and reliability.
• Troubleshoot and resolve equipment and process issues.

Skills

Wire bonding techniques

Process optimization

Statistical tools

Analytical skills

Communication skills

Education

Bachelor’s degree in Engineering

Tools

JMP

Minitab

ASM wire bonders

Job description

Senior/Staff Wire Bond Equipment & Process Engineer

We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.

What You Will Do

• Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
• Develop and implement process improvements to enhance yield, reliability, and throughput.
• Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
• Collaborate with design, quality, and manufacturing teams to support new product introductions.
• Analyze process data to identify trends and implement corrective or preventative actions.
• Mentor junior engineers and share best practices within the team.
• Ensure compliance with safety, quality, and environmental standards.
• Update FMEA, Control Plan, OCAP, SPC and other related documents for Equipment and Process.
• Internal and External audit.
• Cost / MVA project and other related project for Equipment and Process.
• Other activities assigned by superior.

What You Will Need

• Bachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper. Others wire type handling is a plus.
• Solid Hands-on experience in ASM wire bonders, bonder programming, and process optimization. KNS Hands-on experience is a plus.
• Solid analytical and problem-solving skills, with experience using data to drive decisions.
• Knowledge of semiconductor manufacturing standards, quality control, and reliability testing.
• Statistical Knowledge/Hands-on in JMP, Minitab and/or other statistical tools.
• Excellent communication and collaboration skills; ability to work across teams.

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

"Nexperia shall not engage in discrimination based on race, color, age, gender, sexual orientation, gender identity and expression, ethnicity or national origin, disability, pregnancy, religion, political affiliation, covered veteran status, protected genetic information or marital status in hiring."