Senior Engineer Failure Analysis

Infineon Technologies; Kulim; On-site; MYR 80,000 - 100,000; Full time

Job summary

A leading semiconductor solutions provider in Malaysia is seeking a qualified candidate to perform failure analysis on semiconductor devices. The role involves conducting detailed investigations, preparing analytical reports, and collaborating with cross-functional teams to identify root causes. Candidates should possess a degree in Electrical and Electronic Engineering and have experience in electrical failure verification and localization techniques. Join us to drive innovation and ensure quality in our semiconductor offerings.

Responsibilities

• Perform Discrete/IC Devices Failure Analysis on Package & Die level.
• Prepare FA reports for cross-functional teams.
• Participate in cross-functional meetings presenting FA results.
• Interface with various engineering teams to understand analysis requirements.
• Achieve assigned KPIs.
• Setup application board and product-specific test methodologies.
• Navigate CAD for failure location analysis.
• Conduct Fault Tree Analysis if no physical defect is found.

Skills

Electrical Failure Verification and Localization

Sample preparation

Imaging techniques

Repackaging skill

Basic CAD Navigation System

Semiconductor processing

Education

Degree / Master / PhD in Electrical and Electronic Engineering

Job description

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

Your Role

Key responsibilities in your new role

1. Perform Discrete/IC Devices Failure Analysis [FA] on Package & Die level from electrical verification, fault isolation and physical root cause analysis.
2. Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
3. Participate and present FA results in cross functional meetings.
4. Interface with designers, test, product, process integration and unit process engineers, problem solving team, CQM team to understand the analysis requirement.
5. Responsible for achieving KPIs.
6. Setup of application board, product specific test methodology and localization capability.
7. CAD navigation, layout and schematic analysis to identify the failure location and hypothesis
8. Responsible for Fault Tree Analysis (FTA) in case of no physical defect found.

Your Profile

Qualifications and skills to help you succeed

Academic qualification

• Degree / Master / PhD in Electrical and Electronic Engineering.

Job experience

• Electrical Failure Verification and Localization, i.e. bench test integration, LIVA/TIVA
• Sample preparation, i.e. wet/dry chemical, backside preparation, package preparation.
• Imaging, i.e. optical, SEM and FIB (incl. Voltage Contrast).
• Repackaging skill i.e. Chip On Board, Manual Wire bonder
• Basic CAD Navigation System
• Semiconductor processing, fabrication and testing.

Leadership

• No direct supervisory Responsibility, Provides on-the-job training to more junior colleagues.

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