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Process Development Staff Engineer

ams OSRAM

Bayan Lepas

On-site

MYR 70,000 - 90,000

Full time

3 days ago
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Job summary

A leading semiconductor company in Bayan Lepas, Malaysia, seeks a Process Engineer to develop and optimize EOL processes, focusing on the Die Attach method for new product projects. Candidates should have a Degree or Master's in Engineering and 2-3 years of experience in the semiconductor industry. The role includes technical guidance for junior staff and participation in engineering samples and ramp-up builds. A strong knowledge of process development and statistical analysis is required.

Qualifications

  • Degree or Master's in relevant engineering field required.
  • 2-3 years of experience in semiconductor processes necessary.
  • Familiarity with Die Attach or Wire Bond processes is preferred.

Responsibilities

  • Develop and optimize EOL processes with a focus on Die Attach for new products.
  • Participate in technology roadmap and building block activities.
  • Provide technical guidance to junior staff and participate in build processes.

Skills

Knowledge in process development steps
Statistical analysis
Minitab knowledge
Six Sigma Green or Black Belt

Education

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering
Job description

Develop and optimize EOL processes; especially Die Attach process for new product development project to meet project cost, quality and timeline targets.

Participate and support EOL processes technology roadmap and building block activities.

Equipment selection which meet project cost, quality and timeline target.

Share and transfer technical know how within R&D and to Manufacturing team.

Provide technical guidance or job coaching to junior supporting staff.

Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

Requirements

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.

2-3 years in semiconductor field especially in Die Attach, Wire Bond, or Testing process.

Process engineering knowledge in semiconductors or LED manufacturing processes especially Package Saw and Molding processes.

Knowledge in process development step and statistic.

B. Minitab knowledge will be advantage.

Six Sigma Green or Black Belt will be advantage.

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