
Enable job alerts via email!
Generate a tailored resume in minutes
Land an interview and earn more. Learn more
A leading semiconductor company in Bayan Lepas, Malaysia, seeks a Process Engineer to develop and optimize EOL processes, focusing on the Die Attach method for new product projects. Candidates should have a Degree or Master's in Engineering and 2-3 years of experience in the semiconductor industry. The role includes technical guidance for junior staff and participation in engineering samples and ramp-up builds. A strong knowledge of process development and statistical analysis is required.
Develop and optimize EOL processes; especially Die Attach process for new product development project to meet project cost, quality and timeline targets.
Participate and support EOL processes technology roadmap and building block activities.
Equipment selection which meet project cost, quality and timeline target.
Share and transfer technical know how within R&D and to Manufacturing team.
Provide technical guidance or job coaching to junior supporting staff.
Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.
Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
2-3 years in semiconductor field especially in Die Attach, Wire Bond, or Testing process.
Process engineering knowledge in semiconductors or LED manufacturing processes especially Package Saw and Molding processes.
Knowledge in process development step and statistic.
B. Minitab knowledge will be advantage.
Six Sigma Green or Black Belt will be advantage.