Engr Prin, Package Development (NPI Mold Engineer)

onsemi; Seremban; On-site; MYR 164,000 - 247,000; Full time

Job summary

A leading technology company in Malaysia is looking for an experienced engineer to focus on package development, particularly in molding and process improvement. You will be responsible for end-of-line process development and must possess strong skills in statistical analysis, as well as familiarity with tools like JMP and Minitab. The ideal candidate should have a degree in engineering and be self-motivated. This position offers an opportunity to influence the future of intelligent power technologies.

Benefits

Career growth opportunities

Positive recruitment experience

Qualifications

• 2+ years in package development.
• Experienced in molding and/or singulation process development.
• Ability to manage people and tasks.

Responsibilities

• Lead process development for molded packages.
• Generate technical reports based on statistical analysis.
• Support manufacturing team with quality issues.

Skills

Process development

Statistical analysis

Technical leadership

Understanding of EHS

Education

Degree or Master in Engineering

Tools

JMP

Minitab

AutoCAD

MS Office

Job description

Job Description

Job Summary

• Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development.
• Key person responsible to align processes between R&D and Manufacturing.
• Establish process POR through set up, feasibility and characterization followed by package development procedure.

Responsibilities

• End of Line process development and enabling technology for molded package.
• Capable to understand the design and proposal for improvement from End of Line process.
• Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
• Familiar with EMC materials.
• Capability to define KPIV from failures modes.
• Capability to define KPOV and generate output by analyzing process capability.
• Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
• Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc.).
• Technical Leadership on End of Line Process.
• Capable to initiate new process and equipment working with technical leader and supplier.
• Responsible for P.O spec generation and buy-off.
• Capable to create COO for new process and equipment.
• Capable for benchmarking on the new and better process/equipment which do not exist in company.
• Capability to create End of Line process technology roadmap, especially for molding.
• Capability to generate new design rule based on characterization, working with technical leader and designer.
• Capable to understand customer requirements, application and EHS.
• Capable to find systematic solution and improvement planning for process defects.
• Supporting quality issue during production, effectively working with manufacturing team.

Qualifications

• 2+ years in package development.
• Experienced areas: Molding and/or singulation process development.
• Experienced packages: Transfer molded power module (Intelligent Power Module, Dual Side Cooling Module, Power Discrete) is an advantage.
• Degree or Master in any Engineering fields.
• Familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (PowerPoint presentation).
• Personal characteristics: Self-motivated, independent, open mind to communicate, willing to take risk and ability to manage people and task.

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end‑markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high‑growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end‑markets are responsible for two‑thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net‑zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net‑zero emissions by 2040.

More Details About Our Company Benefits

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high‑performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.