Principal Engineer Platform Management

Infineon Technologies; Malacca City; On-site; MYR 150,000 - 200,000; Full time

Job summary

A global leader in semiconductor solutions seeks a professional in Malacca to manage the package platform roadmap and optimize technical capabilities. The ideal candidate will have a Master’s or Bachelor’s degree in Engineering and extensive experience in the semiconductor industry. Responsibilities include overseeing the platform's life cycle and defining the release strategy. Join us in driving innovation for green, efficient energy and mobility solutions, in a diverse and inclusive work environment.

Qualifications

• 6-8 years of experience in semiconductor related industry.
• Experience in road-mapping and strategy definition.
• Knowledge in semiconductor package engineering.

Responsibilities

• Responsible for package platform roadmap and managing current and future technical capability.
• Manage platform portfolio during whole life cycle.
• Release platform strategy aligned to segment management.

Skills

Semiconductor package engineering

Strategy definition

Business risk and impact analysis

Capability in anticipating issues

Education

Masters/Bachelor's Degree in Engineering

Job description

Your Role

Key responsibilities in your new role

• Responsible for package platform roadmap and to manage package platform current and future technical capability, portfolio and to optimize package cost position.
• Manage platform portfolio during whole life cycle, identifies platform capability and its extensions, supports definition of new products in platform, product changes, transfer and ramp‑down.
• Release platform strategy aligned to segment management as owner. Defines capability (package portfolio, BoM, reliability, production line location) of platform in‑house and subcon production.
• Owner of platform design rules (BDR) (release, maintain and update) and as owner of standard package catalogue.
• Initiate and monitor technology development projects on platform to improve cost position, package reliability and technical capability (in‑house and subcon).
• Supports package concept engineers in product lines and backend segments on new product design to match with current and future platform capability.

Your Profile

Qualifications And Skills To Help You Succeed

• Masters/Bachelor’s Degree in Engineering (Electrical / Electronics / Microelectronics / Mechanical / Materials).
• 6‑8 years of experience in semiconductor related industry.
• Experience in road‑mapping and strategy definition.
• Knowledge in semiconductor package engineering.
• Business risk and impact analysis.
• Capability in anticipating issues and challenges and resolving them quickly.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant’s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the process.