Die Bond Process Engineer: Yield & Quality Automation

Infineon Technologies; Malacca City; On-site; MYR 60,000 - 80,000; Full time

Job summary

A global semiconductor leader in Malaysia is seeking a Die Bond expert responsible for achieving robust and auto-pilot processes. Key responsibilities include supporting new technology development, driving closure of 8D processes, and leading quality improvement activities. Candidates should have a Bachelor's or Master's degree in a relevant engineering field and over 2 years of experience in FOL Process Engineering or Semiconductor Assembly. Join us and contribute to innovative solutions for a greener technology future.

Qualifications

• More than 2 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.

Responsibilities

• Supports development of new technologies and ensures smooth take-over into volume production.
• Accountable and drive for 8D closure of FAR, MRB, DDM, LOH and SDCAR.
• Leading and participating in yield & quality improvement.

Skills

Process & product control

Productivity/process improvement

First level reliability

Die Bond Process

Education

Bachelor's or Master degree in Mechanical, Manufacturing, Electronics or related Engineering

Job description

A global semiconductor leader in Malaysia is seeking a Die Bond expert responsible for achieving robust and auto-pilot processes. Key responsibilities include supporting new technology development, driving closure of 8D processes, and leading quality improvement activities. Candidates should have a Bachelor's or Master's degree in a relevant engineering field and over 2 years of experience in FOL Process Engineering or Semiconductor Assembly. Join us and contribute to innovative solutions for a greener technology future.