Staff Process Engineer

Randstad; Ipoh; On-site; MYR 100,000 - 140,000; Full time

Job summary

A leading recruitment agency is looking for an engineering professional in Malaysia to manage PQFN packages. The role requires expertise in process engineering, with responsibilities including qualification of designs and managing manufacturing quality. Applicants should have a relevant degree and experience in semiconductor assembly processes, as well as strong communication skills. The position offers opportunities for local and international travel.

Qualifications

• Experience in process engineering or package development for thin wafer handling.
• Understand capabilities and limitations of PQFNs/QFNs/WLCSP.
• Successful qualification and release of new packages into production.

Responsibilities

• Identify suitable designs and processes for PQFN packages.
• Establish and execute process characterizations and qualifications.
• Manage cost-saving projects and improve manufacturing quality.
• Coordinate assembly yield and quality improvement activities.

Skills

Process engineering knowledge

Strong analytical skills

Interpersonal communication

Knowledge of SPC

Education

PhD / Masters / Bachelor Degree in Mechanical, Material Engineering, Physics, Chemistry or Applied Sciences

Tools

Statistical analysis software (JMP)

Job description

Responsibilities

• Identify suitable designs, equipment and processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Establish and Execute Process characterizations, Qualifications, customer PCN for the related packages and OSAT sites.
• Manage cost saving projects of alternate BOM / alternate post fab qualifications; including phasing in to production effectively.
• Working with OSAT, review and update process/equipment specs and related documents to ensure quality and yields are above the established baseline.
• Ramp up manufacturing volume as committed.
• Identify and coordinate assembly yield, quality and cost improvement activities.
• Implement WIP data tracking, monitor yields/quality indices real time.
• Address internal and external customer feeback/issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents and systems to ensure they are current.
• Conduct change management with suppliers to sustain/improve capacity and improving cost.

Qualifications

• PhD / Masters / Bachelor Degree in Mechanical, Material Engineering, Physics, Chemistry or Applied Sciences.
• Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
• Fully understand the process / package capabilities, limitations and quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
• Skillful knowledge of standard semiconductor assembly processes. Knowledge of SPC and statistical analysis software (such as JMP).
• Personal merit should include successful qualification and releasing of new packages into production.
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills.
• Willing to travel locally and abroad in short notices.