Staff Engineer Unit Process Development Wire Bond

Infineon Technologies; Malacca City; On-site; MYR 80,000 - 100,000; Full time

Job summary

A global semiconductor company is looking for a skilled professional to manage process development activities in Malacca. The ideal candidate will have over 5 years of experience in wire bonding process development and a strong background in statistical analysis tools. You will be responsible for technical documentation, liaising with suppliers, and participating in problem-solving initiatives. The company emphasizes diversity and inclusion, offering a collaborative work environment and opportunities for innovation.

Qualifications

• More than 5 years working experience in wire bonding process development.
• Knowledge in ball bonding at wire bonder platform such as Shinkawa and ASM.
• Experience in Font of Line vision inspection is a plus.

Responsibilities

• Responsible for technical handshake and knowledge transfer to operation.
• Generate and update relevant documents for development projects.
• Liaise with suppliers for verification and qualification activities.

Skills

Wire bonding process development

Ball bonding experience

Statistical analysis software knowledge

Innovative and creative

Good teamwork

Tools

JMP

CEDA

Minitab

Job description

Perform process development activities (Parameter scouting, Optimization, Verification, Process Freeze, Qualification, Safe launch) to meet project targets in terms of timeline, quality, cost and manufacturability.

Your Role

Key responsibilities in your new role

• Responsible for technical handshake and knowledge transfer to operation.
• Generate and update relevant documents, example Process development record (PDR), Process specification, PFMEA, DFMEA, OJTI, T32.
• Provide inputs for updating of related documents and responsible for their correct contents, e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance check list, etc. for development projects.
• Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in development projects.
• Participate and support problem solving team using statistical and analytical tools, e.g. SPC, APC, DOE, 8D, FMEA, DFMEA.
• Identify and develop new process technology and improve process capability to meet new requirements from business divisions.

Your Profile

Qualifications And Skills To Help You Succeed

• More than 5 years working experience in wire bonding process development.
• Knowledge in ball bonding at wire bonder platform such as Shinkawa and ASM. Experience in Font of Line vision inspection stay advantage.
• Knowledge on statistical analysis software such as JMP, CEDA, Minitab.
• Good teamwork and approachable.
• Always striving for excellence in the tasks given.
• Innovative and creative.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.