Staff Hardware Development Engineer (Package Design)

Advanced Micro Devices; Penang; On-site; MYR 150,000 - 200,000; Full time

Job summary

A leading technology company in Penang, Malaysia is seeking an experienced package design engineer to join its Adaptive and Embedded Computing Group. This role entails working across chip, technology, and systems to deliver cost-effective and high-performance solutions. Candidates should possess a strong understanding of Cadence tools, PCB layout experience, and a degree in Engineering. The company promotes an inclusive culture and offers competitive benefits for its employees.

Qualifications

• Experience in understanding electrical requirements and translating them to package technology requirements.
• Ability to perform power integrity analysis for core as well as IO.
• Experience mentoring junior package designers.

Responsibilities

• Conduct design using Cadence tools and enable closure of designs.
• Define package/module design requirements during project conception stages.
• Develop multi-signal package/module models.

Skills

Communication skills

Understanding of organic/PCB technologies

Cadence package design tools

High-power, Gbps IO products

2D/3D package design tools

Education

Bachelor's or Master's degree in Engineering

Tools

Cadence

Ansys

AutoCAD

Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next‑generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.

Together, we advance your career.

THE ROLE:

The AMD Adaptive and Embedded Computing Group is seeking an experienced and self‑motivated package design engineer. As a key member of the Package group, you will work across chip, technology and systems teams to define cost‑effective and high‑performance solutions.

THE PERSON:

This is a high visibility position working on multiple package families for the FPGA devices. The ideal candidate should have the ability to understand electrical requirements and translate to the proper package technology requirements that are cost effective and manufacturable. This role requires good communication skills to work with other teams and engineers at the various design centers to carry the projects from design start to signoff stages.

KEY RESPONSIBILITIES:

• Use Cadence tools for design, modeling and simulations. Enable timely closure of designs by getting involved with pre‑design negotiations with chip/system teams and taking it to design sign off.
• Use analytical and simulation tools to define package/module design requirements (technology, stack‑up etc) in the project conception stages and negotiate with chip/system teams on product specification.
• Conduct routing, stack‑up & component placement studies in addition to completing the package design activities. Translate requirements (design guidelines, technology, stack‑up, manufacturing time etc) for various device packaging.
• Collaborate with PCB Layout Engineers to optimize the package ball‑map and chip team to optimize the die size.
• Develop multi‑signal package/module models over 50 GHz bandwidth and suitable test structures for model‑to‑measurement correlation.
• Come up with performance metrics for organic package technologies in order to design high‑speed chips and systems.
• Perform power integrity analysis for core as well as IO and generate power delivery network requirements with emphasis on model‑to‑measurement correlation.
• Develop scripts for checking package parameters across device families, maintain a database of electrical design guidelines and rules for IO and PDN package layout implementations.

PREFERRED EXPERIENCE:

• Have a good understanding of various organic/PCB technologies in order to interpret/negotiate layout guidelines.
• Package/PCB layout experience. Experience in high‑power, Gbps IO products is a plus.
• Current working knowledge of Cadence package design tool is a must. Knowledge of SKILL is a plus.
• Working knowledge of 2D/3D package design and modeling tools, such as Cadence, Ansys, AutoCAD, etc.
• Knowledge on DoE, DFM/DFR is a plus.
• Good knowledge of SerDes design and package/PCB layout constraints.
• Mentor junior package designers in the group.

ACADEMIC CREDENTIALS:

• Bachelor’s or Master’s degree in Engineering.

LOCATION:

Penang, Malaysia

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.