Quality Control jobs in Singapore

Responsible for driving process integration and yield improvement in wafer bumping operations. This role collaborates cross-functionally to resolve process issues, execute improvement initiatives, and support product transitions from NPI to mass production.

Troubleshoot bumping process (Dry & Wet) issues via DOE

Analyze yield data and detect trends

Lead continuous improvement and device qualification projects using APQP

Execute cost and yield improvement programs (CIP)

Optimize SPC limits to maintain process control

Handle customer spec reviews and technical inquiries

Coordinate BKM (Best Known Method) exercises initiated by customers

Degree in Engineering

3+ years of experience in semiconductor process integration or yield engineering

Hands-on experience in bumping or front-end wafer fab processes

Skilled in data analysis, SPC, and APQP methodologies

Strong analytical, coordination, and problem-solving abilities

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

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