Network Engineer jobs in Singapore
Software Engineer – Thermocompression Bonder Control Systems
PYXIS CF PTE. LTD.
IT Support Engineer (6-months Contract)
KGI SECURITIES (SINGAPORE) PTE. LTD.
Robotics Software Engineer
Lionsbot International Pte Ltd
Discover more opportunities than anywhere else. Find more jobs nowSAP Supply Chain Solution Architect (SAP PM)
NCS Pte Ltd
Connect with headhunters to apply for similar jobsICT Specialist (Healthcare | Harbourfront)
Good Job Creations (Singapore) Pte Ltd
Senior Software Engineer (Singaporean only)
TG Group Pte Ltd
Software Engineer [1-3 Years Exp, Java, JavaScript]
Talentsis
Application Support Engineer
NUBITEL TECHNOLOGY PTE. LTD.
Technical Support Engineer (IT/Electrical/Electronic) Commission Given
SEARCH PERSONNEL PRIVATE LIMITED
Senior Software Engineer
Transcelestial Technologies Pte. Ltd.
Software Engineer – Thermocompression Bonder Control Systems
Job summary
A technology company in Singapore is seeking a skilled Software Engineer to develop precision motion control software for advanced semiconductor packaging systems. The ideal candidate will have over 5 years of experience in real-time motion control, proficiency in C/C++ and Python, and expertise in multi-axis systems. Join us to innovate in high-precision applications, collaborating closely with engineering teams.
Qualifications
- 5+ years of experience in real-time motion or robotic control.
- Expertise in C/C++, Python, and PLC programming (TwinCAT, Codesys, or similar).
- Experience with real-time operating systems.
- Strong understanding of control loop tuning.
Responsibilities
- Architect and implement real-time motion control software.
- Develop closed-loop control algorithms for various subsystems.
- Integrate feedback loops for nanometer-level precision.
- Synchronize control timing across domains.
Skills
Education
Tools
The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning, sub-Newton bonding force, and tight temperature regulation.
- Architect and implement real-time motion control software for multi-axis (X, Y, θ, Z) precision systems.
- Develop closed-loop PID and adaptive control algorithms for force, height, and thermal control subsystems.
- Integrate temperature, displacement, and force feedback loops for nanometer-level repeatability.
- Design software interfaces for heater ramp-up and dwell control (±5 °C accuracy).
- Collaborate with mechatronics and EE teams to synchronize control timing across motion, force, and temperature domains.
- Optimize bond process cycles using advanced motion trajectories and event synchronization.
- Develop diagnostic and calibration routines for alignment, tilt, and Z-force verification.
- Implement data logging and predictive diagnostics for machine health and precision drift.
- Bachelor’s or Master’s in Computer Engineering, Control Systems, or Mechatronics
- 5+ years of experience in real-time motion or robotic control.
- Expertise in C/C++, Python, and IEC 61131-3 PLC programming (TwinCAT, Codesys, or similar).
- Experience with EtherCAT-based motion systems and real-time operating systems (RTOS).
- Strong understanding of multi-axis kinematics and control loop tuning.
- Experience in semiconductor assembly equipment software.
- Familiarity with dSPACE, Speedgoat, or National Instruments (NI) CompactRIO platforms.
- Experience with Beckhoff TwinCAT 3, ACS Motion Control SPiiPlus, or Delta Tau PMAC control architectures.
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.