Software Engineer – Thermocompression Bonder Control Systems

PYXIS CF PTE. LTD.; Singapore; On-site; SGD 75,000 - 100,000; Full time

Job summary

A technology company in Singapore is seeking a skilled Software Engineer to develop precision motion control software for advanced semiconductor packaging systems. The ideal candidate will have over 5 years of experience in real-time motion control, proficiency in C/C++ and Python, and expertise in multi-axis systems. Join us to innovate in high-precision applications, collaborating closely with engineering teams.

Qualifications

• 5+ years of experience in real-time motion or robotic control.
• Expertise in C/C++, Python, and PLC programming (TwinCAT, Codesys, or similar).
• Experience with real-time operating systems.
• Strong understanding of control loop tuning.

Responsibilities

• Architect and implement real-time motion control software.
• Develop closed-loop control algorithms for various subsystems.
• Integrate feedback loops for nanometer-level precision.
• Synchronize control timing across domains.

Skills

C/C++

Python

Real-time motion control

Multi-axis kinematics

Education

Bachelor’s or Master’s in Computer Engineering, Control Systems, or Mechatronics

Tools

EtherCAT

IEC 61131-3 PLC programming

Job description

Position Summary

The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning, sub-Newton bonding force, and tight temperature regulation.

Key Responsibilities

• Architect and implement real-time motion control software for multi-axis (X, Y, θ, Z) precision systems.
• Develop closed-loop PID and adaptive control algorithms for force, height, and thermal control subsystems.
• Integrate temperature, displacement, and force feedback loops for nanometer-level repeatability.
• Design software interfaces for heater ramp-up and dwell control (±5 °C accuracy).
• Collaborate with mechatronics and EE teams to synchronize control timing across motion, force, and temperature domains.
• Optimize bond process cycles using advanced motion trajectories and event synchronization.
• Develop diagnostic and calibration routines for alignment, tilt, and Z-force verification.
• Implement data logging and predictive diagnostics for machine health and precision drift.

Required Qualifications

• Bachelor’s or Master’s in Computer Engineering, Control Systems, or Mechatronics
• 5+ years of experience in real-time motion or robotic control.
• Expertise in C/C++, Python, and IEC 61131-3 PLC programming (TwinCAT, Codesys, or similar).
• Experience with EtherCAT-based motion systems and real-time operating systems (RTOS).
• Strong understanding of multi-axis kinematics and control loop tuning.

Preferred Qualifications

• Experience in semiconductor assembly equipment software.
• Familiarity with dSPACE, Speedgoat, or National Instruments (NI) CompactRIO platforms.
• Experience with Beckhoff TwinCAT 3, ACS Motion Control SPiiPlus, or Delta Tau PMAC control architectures.