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Job Description

Position Title: Opto-Mechanical Design Engineer

Employment Type: Full-time

Location: Ottawa, Onsite

About Lumentum

Welcome to Lumentum! We’re all about harnessing cutting-edge tech to create a brighter, more connected future. We are the leaders in optical and photonic products, working at the intersection of innovation and impact. Here’s what we’re up to:

Minimum qualifications:

• BS in Mechanical Engineering or equivalent
• Experience in opto-mechanical design with working knowledge of mechanical design related to optical performance, thermal performance, shock and vibration, aging, process and manufacturability
• Experience in mechanical design and simulation of advanced semiconductor packages such as flip chips, 2.5D/3D advanced packaging
• Experience in design, simulation and testing of thermal solutions for advanced opto-electronics packages and systems including air-cooling and liquid-cooling solutions
• Proven working knowledge of GD&T standards, metrology, statistical tolerances and how they relate to process and design variations in high volume manufacturing
• Proficiency in using 3D CAD software to work on large assemblies in PLM environment
• Self-motivated, action-focused, and results-oriented individual with strong negotiation skills to collaborate with other functional teams, taking a technical leadership role
• Detail-oriented with a strong sense of ownership and commitment to end-to-end project execution
• Positive attitude and a team player, with the ability to work effectively with different stakeholders in a cross-functional environment
• Desire and capability to learn quickly, continuously improve, and adapt to dynamic challenges
• Ability to drive technical negotiations while balancing performance, time-to-market and cost considerations

Desired qualifications:

• Proven experience addressing complex mechanical and thermal design challenges in products for Co-Packaged Optics (CPO) applications
• Experience in designing products for shock and vibration requirements according to Telcordia standard
• Experience in telecom/datacom photonics product development and manufacturing
• Working knowledge of reliability qualification of semiconductor packages and design-for-reliability (DfR) and industry standards such as IPC, JEDEC, etc.
• Knowledge of material science and behavior of materials including brittle, ductile materials, viscoelastic materials such as adhesives/epoxies, TIMs
• Working knowledge of opto-mechanical STOP (Structural Thermal Optical Performance) analysis and experimental validation (FEA/CFD, design of experiment for model calibration, materials characterization DOE, etc.)
• Previous experience with Structural, Thermal, Analysis & Results(STAR) module in Ansys
• Familiar with optical metrology instruments such as optical interferometry, polarimeter, etc. and testing and post-processing data analysis
• 5-10+ years of experience on opto-mechanical design of optical systems
• Experience in SolidWorks and Solid Edge

What You’ll Be Doing

• Design the opto-mechanical elements of next-generation optical products for telecom, data centers, and AI/ML infrastructure, from concept to completion, in collaboration with cross-functional teams. Ensure designs meet opto-mechanical, thermal performance, reliability, time-to-market, and cost requirements
• Lead concept design evaluations and define the optimal design architecture in collaboration with simulation, optical, design authority, tooling, hardware/electrical, and process teams
• Conduct design reviews, focusing on design for manufacturability (DfM), engineering analysis to predict product performance and reliability, design optimization, material selection, dimensional stability of optics, and tolerance analysis
• Engage with suppliers to explore new technologies and materials for opto-mechanical packaging and advanced semiconductor packaging, including flip chips, 2.5D/3D advanced packaging, adhesives/epoxies/underfills, ceramics, thermal interface materials, hermetic packaging technologies, and thermoelectric coolers
• Perform FEA to evaluate stress, warpage, solder joint reliability in advanced electronics packaging assemblies
• Simulate/quantify linear/nonlinear material behaviors of BGA solder joints, copper pillars, underfills in terms of plasticity/viscoelasticity, creep, etc.
• Drive design of experiments (DOEs) to guide design decisions and process improvements, covering chip warpage, stress-optics, dimensional stability of optics, shock and vibration, and thermal performance
• Document design files, best practices, and internal design guidelines to ensure knowledge retention and continuous improvement

What We’re Looking For

Perks You’ll Love

• Flexible time off
• Health and wellness benefits (physical and mental)
• Tuition reimbursement and career growth support
• A workplace built for you: free gym, games room, prayer room
• Subsidized meals, free coffee/tea
• Employee stock options and incentive plans
• A collaborative, innovative, and inclusive culture

Join a Team That’s Shaping the Future

At Lumentum, we’re more than just a workplace—we’re a launchpad for creativity and innovation. We’re committed to celebrating your unique talents and helping you grow. Our guiding principles—Innovate, Engage, Deliver, Excel, and Win—aren’t just words; they’re the heart of what we do.

Let’s Build a Brighter Future Together!

Equal Opportunity Employer Statement

We’re committed to building an inclusive workplace where everyone feels valued and empowered. We welcome applicants from all backgrounds and provide accommodations for individuals with disabilities throughout the hiring process. Your uniqueness makes us stronger, sparks creativity, and drives our success.

Join us—your future starts here!