Staff Engineer

Infineon Technologies; Tijuana; Presencial; MXN 809,000 - 1,080,000; Jornada completa

Descripción de la vacante

A semiconductor technology company in Tijuana is seeking a Packaging Engineer to define and develop packaging solutions for new products. This role involves driving the technical definition, design, and development of new packages, ensuring they meet electrical and thermal requirements. Candidates should possess a Bachelor's degree in Engineering and experience in semiconductor packaging, along with strong analytical and problem-solving skills. A knowledge of AutoCAD and 3D drafting is preferred. This position fosters innovation and collaboration within diverse teams.

Formación

• Bachelor's degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Experience in semiconductor packaging, assembly, and testing.
• Experience in wire-bond process.

Responsabilidades

• Define and develop the right package for new products/technologies.
• Drive technical definition activities for package projects.
• Generate conceptual package outlines and internal construction drawings.

Conocimientos

Analytical skills

Problem-solving skills

Knowledge in process and equipment engineering

Experience in wire-bond process

Educación

Bachelor's Degree in Engineering

Herramientas

AutoCAD

3D drafting

Descripción del empleo

Infineon is looking for a packaging engineer to define and develop packaging solutions for new products and technologies, driving technical definition, design, and development of new packages.

Job Responsibilities

• Define and develop the right package for new products/technologies from concept and feasibility studies through realization.
• Drive technical definition activities (BOM, package design, assembly technology, review PRP, project classification) for package projects with major changes or new packages, risks, and impact.
• Generate conceptual package outlines and internal construction drawings, finalize and document the drawings, and update them as needed.
• Define package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
• Coordinate package cost estimation and cost indication.
• Engage partners and technical consultants for package definition to the Business Division, especially on BE assembly technology know‑how.
• Be the main driver for the DFMEA.
• Support pre‑development and project definition stages, remaining a package design expert throughout the project phase.
• Actively scout for new packaging technologies and maintain contact with competitors/sub‑contractors in package development.
• Serve as the main contact person and technical consultant/coach for all questions and discussions regarding packaging and package design.
• Drive innovation and pre‑development activities within the package platform.
• Consolidate the inputs for Assembly Design Rules and ensure their contents are updated.

Your Profile

• Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Experience in semiconductor packaging, assembly, and test.
• Experience in wire‑bond process.
• Process and equipment engineering knowledge.
• Failure analysis and reliability engineering experience.
• Analytical and problem‑solving skills.
• AutoCAD and 3D drafting preferred.

We embrace diversity and inclusion and welcome everyone for who they are.