Responsible for developing, programming, optimizing, and sustaining SMT and through-hole manufacturing processes to ensure stable, high-quality, and cost-effective electronic assembly operations. Supports production readiness for new product introductions (NPI) and product transfers, ensuring process capability, tooling readiness, and manufacturing documentation are fully in place.
Process Engineering
- Develop, document, and maintain SMT and through-hole assembly processes including screen printing, pick & place, reflow soldering, wave soldering, and manual insertion.
- Define process parameters and ensure optimal soldering profiles for product quality and throughput.
- Evaluate and select materials, tooling, and fixtures for new and existing products.
- Maintain process documentation including work instructions, setup sheets, and process control plans.
- Lead line setup and qualification activities for new products and transferred assemblies.
- In addition to those required by the department's needs and / or assigned by the Supervisor.
Production Support
- Provide real-time technical support to resolve process and equipment issues impacting production.
- Analyze defects, perform root cause analysis, and implement corrective/preventive actions (CAPA).
- Collaborate with Maintenance and Equipment Technicians to ensure optimal line performance and uptime.
- Program and optimize SMT equipment, including screen printers, placement machines, and reflow ovens, ensuring accuracy, repeatability, and production efficiency.
- Define and validate process parameters for wave soldering and through-hole insertion, ensuring solder joint integrity and process stability.
Continuous Improvement
New Product Introduction & Transfers
Experience
- Previous: Minimum 8 years in SMT and through-hole assembly process engineering.
- Experience setting up and optimizing SMT equipment (printers, pick & place, reflow ovens).
- Experience with wave soldering, selective soldering, and manual insertion processes.
- Background in Lean Manufacturing, process validation, and root cause analysis.
- English level: Advanced
Competencies
- Technical problem-solving and analytical skills.
- Communicationandteamwork.
- Resultsorientation.
- Continuousimprovementmindset.
- Processdiscipline anddocumentationrigor.
Knowledge required
- SMT andthrough-holeprocesstechnologies.
- Solderingmaterialsandequipmentsetup.
- StatisticalProcessControl (SPC) and DOEmethods.
- LeanManufacturingprinciples.Qualitysystems(IPC-A-610, J-STD-001, ISO 9001).