Memory Yield Engineer

North American Production Sharing de México, S.A. de C.V.; Tijuana; Presencial; MXN 1,059,000 - 1,589,000; Jornada completa

Descripción de la vacante

A leading technology innovator is seeking an experienced professional for a role focusing on chip architecture evaluation and 3DIC technology development. The ideal candidate will have a background in AI relevant systems with at least 5 years of experience and a related degree. Responsibilities include assessing 3DIC process technology requirements and performing PPAC assessments for new product development. This is a great opportunity to contribute to cutting-edge technology in an innovative environment.

Formación

• 5+ years of AI relevant system and technology experience.
• Ability to work across teams and without supervision.
• Familiarity with heterogeneous integration processes such as hybrid bonding.

Responsabilidades

• Define and assess 3DIC process technology requirements.
• Conduct PPAC assessment for System-Technology Co-Optimization.
• Evaluate 3D DRAM and Cache SRAM architecture.

Conocimientos

2.5D and 3D STCO experience

System and chip-level architecture experience

Physical design experience with SoIC or CoWoS

Advanced data analysis skills

Hands-on experience with DRC, LVS, PEX

Educación

Bachelor's degree in science, Engineering, or related field

Master's degree in science, Engineering, or related field

PhD in Science, Engineering, or related field

Descripción del empleo

As a leading technology innovator, we push the boundaries of what's possible and drive transformation in communication and data processing to help create a smarter, connected future for all. In this journey, we are evolving into an “AI-first” intelligent-edge powerhouse, combining high-performance, low-power compute and seamless connectivity while pushing intelligence closer to users through ultra-efficient, on-device AI that ensures privacy, personalization, and real-time responsiveness. This is the Invention Age—and this is where you come in.

Key Responsibilities

• Work with system architecture and SoC design teams, define and assess 3DIC process technology requirements and roadmap.
• PPAC assessment for System-Technology Co-Optimization (STCO) for new product development.
• Foundry interface for 3DIC physical design flow and key design rule definitions.
• Establish dependency of 3D process solutions on key chip architecture and design KPI and co-optimize 3D solutions accordingly.
• Pathfinding and development of chiplet physical design methodology and PDK development.
• 3D DRAM and Cache SRAM Architecture evaluation for AI and other Compute workloads.
• Custom DRAM integration technology evaluation and pathfinding.

Desired Skillset/Experience

• Experience with 2.5D and 3D STCO and pathfinding.
• 2.5D and 3D chip partition and dependencies on product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc.
• System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus).
• Physical design experience with SoIC and/or CoWoS.
• Experience with 2.5D/3D IC design flow and PDK development.
• Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization.
• Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment.
• Custom layout, svrf, scripting skills.
• Hands-on experience with DRC, LVS, PEX (a plus).
• Ability to work across teams and BUs.
• Ability to work without supervision and as part of a team.
• Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach.
• Advanced data analysis and interpretation skills are required.

Requirements

• Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience.
• OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience.
• OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.