Failure Analysis Engineer
Position Summary
The Failure Analysis Engineer is responsible for identifying, analyzing, and determining the root causes of failures in electronic components, assemblies, and systems. This role plays a critical part in improving product reliability, supporting manufacturing operations, and driving continuous improvement initiatives across the organization. The ideal candidate has strong analytical skills, hands‑on laboratory experience, and a solid understanding of electronics, materials, and semiconductor technologies.
Key Responsibilities
Failure Analysis & Investigation
- Perform detailed electrical, mechanical, and material-level investigations to determine root causes of component or system failures.
- Use analytical tools such as X‑Ray, SEM/EDS, SAM, Optical Microscopy, FTIR, XRF, TDR, oscilloscopes, and curve tracers.
- Conduct destructive and non-destructive testing of electronic components, PCBs, and assemblies.
- Develop comprehensive FA reports with clear findings, conclusions, and recommendations.
Root Cause & Corrective Action (RCCA)
- Utilize methodologies such as 5 Why, Fishbone, 8D, FMEA to drive structured problem-solving.
- Collaborate with Engineering, Quality, and Manufacturing teams to implement corrective and preventive actions.
- Support product reliability improvement initiatives through trend analysis and risk identification.
Product & Process Support
- Provide FA support for customer returns (RMA), production issues, reliability testing, and new product introduction (NPI).
- Analyze failure trends and communicate findings to cross‑functional teams for continuous improvement.
- Work closely with suppliers to address component‑level defects or process issues.
Documentation & Communication
- Create and maintain detailed documentation of FA procedures, test results, and recommendations.
- Present findings to engineering teams, leadership, and customers as needed.
- Ensure all analyses follow industry standards (IPC, JEDEC, ISO, etc.).
Qualifications
Education
- Bachelor’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Physics, or related field.
- Master’s degree preferred (optional).
Experience
- 2+ years of experience in failure analysis, reliability engineering, electronics manufacturing, or semiconductor environment.
- Experience working in a high‑volume electronics or components manufacturing environment preferred.
Technical Skills
- Strong understanding of electronic components (ICs, passives, PCBs, power electronics, sensors).
- Skilled in FA tools: SEM/EDS, X‑Ray, SAM, oscilloscopes, curve tracers, thermal imaging, etc.
- Familiar with reliability testing methods (HALT, HASS, HTOL, burn‑in, thermal cycling).