Ingeniero / A Procesos Packaging

Institute of Microelectronics of Barcelona (IMB-CNM, CSIC); Cerdanyola del Vallés; Presencial; EUR 50.000 - 70.000; Jornada completa

Descripción de la vacante

A leading research institute in micro and nano technologies in Barcelona is seeking a Clean Room Process Engineer. This role involves performing and verifying process tasks in the packaging area and resolving production issues. Candidates should have a relevant engineering degree and experience in chip packaging processes, with full working competence in English and Spanish. The position offers involvement in cutting-edge projects with real-world impact.

Formación

• Degree in relevant engineering field.
• Experience in chip packaging processes preferred.
• Full working competence in English and Spanish.

Responsabilidades

• Perform process tasks in the packaging area.
• Resolve incidents and collaborate with project managers.

Conocimientos

Chip packaging processes

Dicing of Silicon Wafers

Soldering

Wire bonding

Epoxy Adhesive Dispensing

Educación

Degree in Semiconductor Engineering

Degree in Nanoscience and Nanotechnology

Degree in Electronics

Degree in Industrial Technology Engineering

Descripción del empleo

Overview

Process Engineer – Clean Room Packaging Area Barcelona (UAB Campus) | Micro / Nano Fabrication | International Research Environment

The IMB-CNM (CSIC) is one of the largest institutes in Spain dedicated to Micro and Nano Technologies and Microsystems, and home to the biggest clean room facilities in the country. We are looking for a Clean Room Process Engineer as part of the project Upgrade of Clean Room Tools and Infrastructure.

This position has a strong service-oriented vocation, aimed at providing high-quality technological solutions both to IMB-CNM researchers and to external users from other research centres and companies.

Responsibilities

• Perform and verify process tasks in the packaging area.
• Resolve incidents and offer solutions in the manufacturing and production areas, collaborating with project managers, researchers and external clients.

Qualifications

Degree in Semiconductor Engineering, Nanoscience and Nanotechnology, Electronics or Industrial Technology Engineering

We are particularly interested in candidates with experience in chip packaging processes and techniques (Dicing of Silicon Wafers and Substrates from Various Materials, Polishing, Soldering, Epoxy Adhesive Dispensing, Wire bonding, Ribbon bonding, Flip Chip).

Location & Language

Full-time position based in Barcelona (UAB Campus).

Involvement in cutting-edge projects with real-world impact

English & Spanish – Full working competence

• Catalan – Not required but valued