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Process Engineer jobs in United Arab Emirates

Process Engineer (Flip chip and Direct Die Attach)

Process Engineer (Flip chip and Direct Die Attach)
Linxens Group
Singapore
SGD 60,000 - 80,000
Urgently required
2 days ago
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Sr. Process Engineer - ETP

Sr. Process Engineer - ETP
Chem - Tech Associates
Singapore
SGD 70,000 - 90,000
Urgently required
2 days ago

Semicon Mold Process Engineer

Semicon Mold Process Engineer
People Profilers
Singapore
SGD 60,000 - 80,000
Urgently required
Today

Senior Process Engineer

Senior Process Engineer
US11345-AIRGAS Airgas USA, LLC
Singapore
SGD 50,000 - 70,000
Urgently required
Yesterday

Process Engineer (Based in Vietnam)

Process Engineer (Based in Vietnam)
COILCRAFT INDUSTRIES SINGAPORE PTE. LTD.
Singapore
SGD 60,000 - 80,000
Urgently required
5 days ago
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Process Engineer (Global Leader; Listed Advance Engineering Manufacturer)

Process Engineer (Global Leader; Listed Advance Engineering Manufacturer)
Borr Drilling
Singapore
SGD 80,000 - 100,000
Urgently required
4 days ago

Optics Process Engineer

Optics Process Engineer
Danaher Corporation
Singapore
SGD 50,000 - 70,000
Urgently required
5 days ago

Process Associate Engineer (12-hour Shift)

Process Associate Engineer (12-hour Shift)
Lumileds Singapore Pte Ltd
Singapore
SGD 45,000 - 60,000
Urgently required
Yesterday
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Staff Process Engineer, Deposition (work location Bangalore, India)

Staff Process Engineer, Deposition (work location Bangalore, India)
Lam Research
Singapore
SGD 60,000 - 100,000
Urgently required
7 days ago

Process Engineer

Process Engineer
BNF Group
Singapore
SGD 50,000 - 80,000
Urgently required
6 days ago

Process Engineer

Process Engineer
Manfield Employment Services Pte Ltd
Singapore
SGD 60,000 - 80,000
Urgently required
5 days ago

TCB Bonding Process Engineer [ Semiconductor industry / Up to $8k ] - 8890

TCB Bonding Process Engineer [ Semiconductor industry / Up to $8k ] - 8890
THE SUPREME HR ADVISORY PTE. LTD.
Singapore
SGD 80,000 - 100,000
Urgently required
7 days ago

Lead Manufacturing Process Engineer (Machining)

Lead Manufacturing Process Engineer (Machining)
GE Vernova
Singapore
SGD 70,000 - 90,000
Urgently required
5 days ago

NPI Process Engineer

NPI Process Engineer
People Profilers
Singapore
SGD 60,000 - 80,000
Urgently required
5 days ago

Process Engineer

Process Engineer
BD Mexico
Singapore
SGD 60,000 - 80,000
Urgently required
5 days ago

Process Engineer

Process Engineer
Connect Energy
Singapore
SGD 80,000 - 120,000
Urgently required
5 days ago

Assistant Process Engineer

Assistant Process Engineer
United Microelectronics Corporation (Singapore Branch)
Singapore
SGD 50,000 - 70,000
Urgently required
5 days ago

Process Engineer

Process Engineer
DR Laser Singapore Pte Ltd
Singapore
SGD 50,000 - 80,000
Urgently required
6 days ago

Process Engineer

Process Engineer
INGRASYS (SINGAPORE) PTE. LTD.
Singapore
SGD 50,000 - 75,000
Urgently required
6 days ago

Process Support Engineer

Process Support Engineer
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Singapore
SGD 60,000 - 80,000
Urgently required
6 days ago

Sr Process Engineer

Sr Process Engineer
Larsen & Toubro
Singapore
SGD 90,000 - 130,000
Urgently required
7 days ago

Senior MSAT Process Engineer

Senior MSAT Process Engineer
NO DEVIATION PTE. LTD.
Singapore
SGD 60,000 - 90,000
Urgently required
7 days ago

Lead Process Safety Engineer

Lead Process Safety Engineer
Connect Energy
Singapore
SGD 120,000 - 150,000
Urgently required
5 days ago

Senior Process Design Engineer (Wastewater Treatment)

Senior Process Design Engineer (Wastewater Treatment)
SmartHire by SEEK
Singapore
SGD 60,000 - 90,000
Urgently required
6 days ago

AOI Process Associate Engineer

AOI Process Associate Engineer
People Profilers
Singapore
SGD 45,000 - 60,000
Urgently required
5 days ago

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Process Engineer (Flip chip and Direct Die Attach)

Be among the first applicants.
Linxens Group
Singapore
SGD 60,000 - 80,000
Be among the first applicants.
3 days ago
Job description

Process Engineer (Flip chip and Direct Die Attach) page is loaded

Process Engineer (Flip chip and Direct Die Attach)
Apply locations Changi time type Full time posted on Posted 17 Days Ago time left to apply End Date: August 11, 2025 (12 days left to apply) job requisition id JR100745

The evolution of technology across the security and identity markets is both deep and never-ending. This is why Linxens ceaselessly invents new technical solutions and has a continuous-improvement program in place at all levels of the company.

Working for Linxens means having the chance to be a part of this innovation!

At Linxens, our employees’ know-how is what makes it possible for us to continually reinvent ourselves as a company and satisfy our customers’ needs. This means that our customers, in turn, can continue to move forward and evolve in their respective business domains, now and in the future. And this is why we invest so much energy in helping our employees hone and expand their skills.

Working for Linxens means investing in your future.

Our growth is creating great opportunities!

Here is a description of the role we are opening:

Job description

Process Parameters Definition, Qualification, and Compliance with Industrialization Performance Standards

  • Lead and organise activities related to Direct Die Attach (DDA) / Flip Chip and Die Attach operations to support new product industrialization, optimizing production efficiency while complying with quality standards, cost, schedule, safety and environment
  • Subject Matter Expert for advanced Direct Die Attach (DDA) / Flip Chip and Die Attach technology
  • Prepare and review equipment specifications, select appropriate potential suppliers based on objective criteria
  • Supervise related manufacturing line setup and commissioning
  • Define machine process parameters and work instructions
  • Lead Process Qualification (Installation Qualification (IQ),Operational Qualification (OQ),Performance Qualification (PQ)for the installed manufacturing line/ equipment
  • Execute gap analysis
  • Manage with Engineering /Maintenance and Operations to release new manufacturing line to operations (including standards, instructions, and OCAP etc)
  • Perform gap analysis (machine, workforce, skill sets) in accordance with operations and quality requirements and implement improvement actions accordingly
  • Continuous improvements - Identify and implement cost saving initiatives related to packaging materials, labor efficiency, integration of process, handling, etc

New Product Introduction

  • Participate in new product introduction to deliver new products to market
  • Analyze the manufacturing options vs. product requirements
  • Understand current standards in substrate and packaging processes and propose optimization of company design for manufacturability, focusing in Direct Die Attach (DDA) / Flip Chip and conventional Die Attach applications
  • Contributes to defining new packaging solutions for RFID and Smartcard, enabling better mechanical, thermal or electrical performance on the targeted applications
  • Interfaces with other engineering functions to coordinate the release of new products and/ or product improvements
  • Launches, releases, approves, implements or issues engineering change requests whenever required
  • Performs Process Failure Mode, Effects and Criticality Analysis when working with New Product Development

Job requirements

  • Bachelor's degree in Engineering / Electronics / Electronics packaging or equivalent
  • At least 3 years of experience in Direct Die Attach / Flip Chip packaging
  • Strong knowledge and understanding in Flip Chip and Die Attach technologies in IC packaging industries

If you like having an impact on wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

LINXENS is an equal-opportunity employer that strictly prohibits unlawful or unethical discrimination. Moreover, as part of our CSR Vitality program, we have committed to recruit, hire, train, compensate, and promote without regard to an individual’s race, color, religion, gender, sexual orientation, gender identity, national origin, age, mental/physical disability, marital status, or any other characteristic protected by law.

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* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.

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