Photonics Packaging Engineer

IC Resources; Toscana; In loco; EUR 40.000 - 60.000; Tempo pieno

Descrizione del lavoro

A leading international start-up in Tuscany is seeking a Photonics Packaging Engineer. This role involves the design, assembly, and optimization of advanced photonic packaging solutions, requiring expertise in semiconductor packaging and a collaborative spirit. Ideal candidates will have a Master's in a relevant field and experience with assembly processes. Join a dynamic R&D team contributing to cutting-edge photonic systems.

Competenze

• Engineer with experience in the packaging of photonic and optoelectronic devices.
• Motivated to grow within a multidisciplinary team.

Mansioni

• Design, assemble, and optimize advanced photonic packaging solutions.
• Contribute directly to the development of next‑generation photonic systems.

Conoscenze

Knowledge of semiconductor and photonics packaging concepts

Familiarity with semiconductor assembly processes

Experience in a cleanroom or precision assembly environment

Strong verbal and written communication skills

Formazione

Master’s degree in physics, Electrical Engineering, Electronics Engineering, or related field

Descrizione del lavoro

Join to apply for the Photonics Packaging Engineer role at IC Resources

Our international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R&D team. The successful candidate will be responsible for the design, assembly, and optimisation of advanced photonic packaging solutions, contributing directly to the development of next‑generation photonic systems. The ideal candidate combines strong technical expertise in photonics packaging and semiconductor assembly with excellent communication and teamwork skills, and thrives in a collaborative, cross‑functional environment. This position is suited for an engineer with some professional experience who is motivated to grow within a multidisciplinary team.

Required Skills

• Knowledge of semiconductor and photonics packaging concepts
• Familiarity with semiconductor assembly processes, including flip‑chip and wire‑bonding manufacturing flows
• Experience working in a cleanroom or precision assembly environment
• Strong verbal and written communication skills
• Master’s degree in physics, Electrical Engineering, Electronics Engineering, or related field

Please contact Rachel Anderson for further details.