Advanced Packaging Engineer

JR Italy; Trieste/Trst; In loco; EUR 60.000 - 80.000; Tempo pieno

Descrizione del lavoro

A cutting-edge technology start-up in Trieste is seeking an Advanced Packaging Engineer to lead device packaging projects and develop advanced 2.5/3D solutions. The role includes managing the internal team and collaborating with OSATs. Candidates should have strong semiconductor packaging experience and excellent communication skills. This position is flexible with remote work options.

Competenze

• Strong semiconductor packaging experience is essential.
• Expertise in 2.5/3D advanced packaging solutions is required.
• Excellent communication skills are a must.

Mansioni

• Develop 2.5/3D advanced packaging solutions.
• Collaborate with OSATs throughout the project cycle.
• Manage the internal packaging team and drive overall development.

Conoscenze

Strong semiconductor packaging experience and knowledge

Expertise in 2.5/3D advanced packaging solutions

Excellent communication skills

Team management abilities

Experience liaising with OSATs

Degree qualification

Descrizione del lavoro

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.

The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.

This position can be worked remotely.

Required skills:

1. Strong semiconductor packaging experience and knowledge
2. Expertise in 2.5/3D advanced packaging solutions
3. Excellent communication skills and team management abilities
4. Experience liaising with OSATs
5. Degree qualification

Please contact Rachel Anderson for further details.