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Harrison Scott Associates
A cutting-edge technology firm in the United Kingdom is currently seeking a skilled Packaging Engineer to join their photonics operations team. In this role, you will collaborate with engineering and product development teams to specify packaging solutions for volume manufacturing. Responsibilities include working with vendors to select assembly processes and managing external vendors. The ideal candidate should have experience in assembly packaging techniques, semiconductor manufacturing knowledge, and a master's degree in a relevant field.
Our cutting edge client is currently searching for a Packaging Engineer to join the photonics operations team. The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture.
Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.
Required skills for the Packaging Engineer will include :
Please contact Rachel Anderson for further details.
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.