Back-end Packaging Design Engineer - Thermo-Compression Bonding (Semiconductor Industry) - YZ11

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A recruitment advisory firm in Alberta is seeking a TCB Design Engineer to design and optimize module subsystems for advanced semiconductor packaging. The ideal candidate will have a background in Materials Science or Engineering, experience in TCB or Laser-Assisted bonding technologies, and proficiency in CAD software like CREO. This full-time role requires excellent troubleshooting skills and hands-on design experience.

Qualifications

• Minimum 2-5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Excellent troubleshooting, risk analysis, and statistical analysis skills.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.

Responsibilities

• Design innovative TCB module assemblies for bonding.
• Collaborate with various engineering teams to improve bonding machines.
• Document all designs, simulations, and test results according to standards.

Skills

3D/2D CAD knowledge

Troubleshooting skills

Knowledge of bonding processes

Statistical analysis (JMP, Minitab)

Thermal/mechanical analysis skills

Education

Bachelor's or Master's degree in Materials Science or Engineering

Tools

CREO Parametric

CREO Windchill PLM

Job description

Role Overview

Position title : TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty Street
Working Days: 5 Day A Week
Working hours: 9:00am - 6:00pm
Salary: $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB module subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Responsibilities

• Design & Development
• Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding
• 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA)
• Planning, Scheduling and Costing of Machine Modules
• Prototyping & Testing
• Oversee fabrication of prototype modules and their integration with TCB platforms
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation
• Process & Manufacturing Support
• Collaborate with Electrical, Vision and Software Engineers for the machine integration
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides
• Compliance & Documentation
• Document all designs, simulations, and test results according to quality management and IP standards
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment

Good-to-have

• Thermal & Mechanical Analysis
• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/bondstage
• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/bondstage to achieve rapid cooling and enhance temperature uniformity
• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation

Required Skills and Qualifications

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field
• Minimum 2-5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus
• Experience with TCB or Laser Assisted bonding technologies is highly preferred
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab)
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure)
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279