Dry Etch MTS / Principal Engineer, Process Development SG, Advanced NAND

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A global leader in semiconductor technology is seeking a Dry Etch MTS/Principal Engineer in Singapore. This position offers a chance to lead innovative dry etch processes in cutting-edge NAND technology development. Candidates should have extensive experience in R&D, particularly in dry etch process development, and possess strong knowledge of plasma physics and statistical process control. A collaborative spirit is essential as you will work with cross-functional teams to solve complex engineering challenges.

Qualifications

• 3-10 years of experience in dry etch process development within R&D.
• 2-3 years of experience in NAND, DRAM, or Logic module development.
• Knowledge of plasma physics and various types of dry etch reactors.

Responsibilities

• Develop and innovate dry etch processes.
• Collaborate with cross-functional teams.
• Present technology roadmaps for current and upcoming nodes.

Skills

Dry etch process development

Problem-solving

Leadership

Statistical process control

Computer skills (MS Office, SAS)

Data science basics

Python coding

Education

MS/PhD in relevant fields

BS in relevant fields

Job description

Job Description

As a Dry Etch MTS/Principal Engineer at Micron, you will join a highly skilled team dedicated to groundbreaking next-generation NAND technology. This role offers outstanding opportunities for innovation, collaboration, and the chance to work with innovative dry etch chambers. You will play a pivotal role in crafting flawless processes that meet and exceed program goals.

Responsibilities

Leading Dry Etch Unit Process and Critical Module Development:

• Develop and innovate dry etch processes to meet structural and electrical specifications.

• Collaborate and lead cross-functional teams to solve complex structural problems.

• Present process and technology roadmaps for current and upcoming technology nodes.

• Work on critical modules such as HAR, Tier by tier etches, WL contacts, and staircase.

Interaction with Other Process Areas:

• Find opportunities and drive towards collaborative solutions.

• Direct technology roadmaps for other areas.

• Lead or participate in cross-functional task force groups targeting specific goals.

• Develop knowledge and expertise in related process hardware or technologies.

Interaction with Dry Etch Peers:

• Act as a resource and mentor for peers in dry etch technology and project management

• Provide critical updates to upper management on project status and impacts

Requirements

Successful candidates for this position will have:

• Demonstrated interest in working within a research and development environment

• 3-10 years of experience in dry etch process development within R&D transferring to manufacturing

• 2-3 years of applicable NAND, DRAM, or Logic module development experience

• Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena

• Demonstrated leadership in problem-solving and managing technical projects

• Understanding of various types of plasma dry etch reactors

• Expertise in statistical process control and analysis

• Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches

• Ability to lead supplier head-to-heads

• Preferred experience in data science basics, Python coding, or AI coding

• Strong computer skills, including MS Office and SAS software like JmP

Education

• MS/PhD in Chemical, Mechanical, Electrical, Material Science, Physics, Molecular Physics, Physical Chemistry, Semiconductor Technology, or related fields with 4-10 years of practical experience in dry etch process development

• BS in Chemical, Mechanical, Electrical Engineering, Materials Engineering, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or similar fields with 7-12 years of pertinent experience