Advanced Packaging Engineer

JR Italy; Perugia; In loco; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

An innovative start-up in Italy is seeking an Advanced Packaging Engineer to lead device packaging projects and develop advanced solutions. Responsibilities include managing teams and liaising with OSATs. Candidates should have strong semiconductor packaging experience, excellent communication skills, and a degree qualification. This role offers the flexibility to work remotely.

Competenze

• Demonstrable experience in semiconductor packaging.
• Knowledge of 2.5/3D advanced packaging solutions.

Mansioni

• Develop 2.5/3D advanced packaging solutions.
• Liaise with OSATs throughout the cycle: concept to quality/reliability.
• Manage the internal packaging team.
• Drive overall package development within the company.

Conoscenze

Strong semiconductor packaging experience and knowledge

Expertise in 2.5/3D advanced packaging solutions

Excellent communication skills

Team management ability

Experience liaising with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Our innovative start-up is developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications. We are seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.

Responsibilities:

1. Develop 2.5/3D advanced packaging solutions.
2. Liaise with OSATs throughout the cycle: concept, explore, design, DFM, engineering runs, development, and quality/reliability.
3. Manage the internal packaging team.
4. Drive overall package development within the company.

This role can be performed remotely.

Required Skills:

• Strong semiconductor packaging experience and knowledge.
• Expertise in 2.5/3D advanced packaging solutions.
• Excellent communication skills and team management ability.
• Experience liaising with OSATs.
• Degree qualification.

Please contact Rachel Anderson for further details.