Professor of Advanced Semiconductor Packaging

University of Strathclyde; United Kingdom; On-site; GBP 70,000 - 100,000; Full time

Job summary

A leading UK university seeks a Professor of Advanced Semiconductor Packaging to lead cutting-edge research and drive innovation in semiconductor technologies. The position involves overseeing the National Advanced Semiconductor Packaging Integration Centre, managing academic projects, and collaborating with industry for practical applications. Candidates should have a PhD and a strong track record in advanced packaging, leading national and international research efforts. This is a full-time, permanent role offering a unique opportunity to shape the future of semiconductor integration.

Qualifications

• PhD in Mechanical, Materials, or Electrical Engineering.
• Substantial experience with industrial engagement.
• Established reputation in advanced packaging.

Responsibilities

• Lead academic research in semiconductor packaging.
• Manage cross-disciplinary teams.
• Develop research and investment programs.
• Collaborate with industry on technical solutions.

Skills

Advanced packaging knowledge

Leadership skills

Industry collaboration

Research and development

Education

PhD in relevant engineering/science discipline

Job description

National Manufacturing Institute Scotland (NMIS)

Organisation/Company University of Strathclyde Department National Manufacturing Institute Scotland (NMIS) Research Field Engineering » Electronic engineering Researcher Profile Established Researcher (R3) Leading Researcher (R4) Positions Postdoc Positions Application Deadline 30 Jan 2026 - 23:59 (Europe/London) Country United Kingdom Type of Contract Permanent Job Status Full-time Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? Yes

Offer Description

The University of Strathclyde has been awarded significant funding by UK Research and Innovation’s Global Talent Fund to recruit leading international researchers in areas of national and global strategic importance. As one of only 12 UK institutions to secure this highly prestigious investment, Strathclyde is uniquely positioned to accelerate its world-class strengths at the intersection of research excellence, industry collaboration and societal impact.

This landmark funding underpins the appointment of a new Professor of Advanced Semiconductor Packaging — a career defining opportunity to shape the future of semiconductor integration technologies in the UK and Beyond. You will drive innovation through the newly established National Advanced Semiconductor Packaging Integration Centre (NASPIC), part of the National Manufacturing Institute Scotland (NMIS), at the Advanced Net Zero Innovation Centre (ANZIC) facility. The Centre is one of a kind as it has been designed to allow for the packaging of a broad range of present and future devices. As Professor of Advanced Semiconductor Packaging you will lead the academic research in the field and will be a facilitator of research on campus and between campus and NMIS in all their areas of Electronic and Electrical Engineering activity. Its open access governance model is unique in Europe and very rare elsewhere. The NASPIC requires a Principal Investigator to work in a challenging applied R&D environment to explore and develop disruptive packaging and integration technologies to make next-generation systems lower cost with more energy and packaging efficiency.

The Professor is an Academic with in-depth knowledge and understanding of all the various aspects of advanced package development that include design, assembly, testing and validation. You will have an academic post in Semiconductor development, Semiconductor Packaging or materials science. Your research will be industry facing. You will have direct contributions to technical solutions that integrate multiple disciplines or technologies to develop advanced semiconductor packaging applications. You should have a clear understanding of current and proposed competitive solutions, key performance indicators, and end-user mission objectives as well as an understanding of the interplay between technologies and engineering design.

The Professor will be required to lead a wide range of diverse disciplines as part of an integrated research project team, working closely alongside the Director of NASPIC, the Principal Engineer and the Engineering Faculty to deliver these tasks on time, quality, and cost. In addition to cross University work, you will also be required to lead investment programs, develop research programs around advanced packaging, consult on the development and submission of CR&D bids with industry, network with other capabilities around the UK and abroad building on the NASPIC capability in ANZIC.

You will be recognised nationally and internationally in semiconductor packaging with an excellent and broad knowledge of engineering, science and technology with prior experience in academia. Industry facing though, the Professor will be able to analyse and translate industrial problems to help exploit our advanced packaging design, materials, assembly process, interconnects and testing facilities.

The Professor will report to the Director of NASPIC with cross University reporting to the Dean of Engineering, deputising as required for the Director of NASPIC, and exemplifying the behaviours and values of collaboration, innovation, and trust. You will be closely working alongside the Director of NASPIC in developing the future strategy, investments and business planning with special regard to the future technology roadmaps in Advanced Packaging. You should have excellent leadership and team working skills, working collaboratively and cooperatively with colleagues both at ANZIC and in the Engineering Faculty, and should be able to communicate with other team members in an encouraging and supportive way.

To be considered for the role, you will have a PhD in relevant engineering/science (Mech, Materials, Electrical) discipline with substantial experience in industrial engagement. You will have an established national and emerging international reputation for advanced packaging and a sustained and outstanding track record of delivering high quality packaging solutions with clear strategic benefit to the customer and the University.