Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico

Foxconn Corporation; Castilla-La Mancha; Presencial; EUR 30.000 - 50.000; Jornada completa

Descripción de la vacante

A global electronics manufacturer is seeking an experienced Engineering Manager to lead the development of advanced manufacturing capabilities. The ideal candidate will have over 10 years in manufacturing engineering with significant experience in the electronics sector and proven management skills. Key responsibilities include collaborating with technical teams and mentoring future leaders. Strong English communication skills are essential. Work location is in Mexico.

Formación

• Minimum of 10 years of Mfg Engineering and Process/Technology Development experience.
• At least 5 years in a management position.
• Experience in electronic manufacturing within a Contract Manufacturer environment.

Responsabilidades

• Lead the Development of Advanced PCBA / SI Mfg capabilities.
• Collaborate with customer technical team and Foxconn R&D.
• Mentor leaders to develop good people skills.

Conocimientos

Leadership

Interpersonal skills

Strong English communication

Project management

Educación

Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields

Descripción del empleo

Responsibilities:

• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework technology, component packaging and / or process material. Fostering strong and collaborative relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Vietnam and global labs to perform all the process and reliability evaluation regularly.
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg Capabilities.
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical professionals.

Requirements:

• 1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
• 2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for PCBA and SI and minimum 5 years in management position.
• 3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM) environment with a proven record.
• 4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are preferable.
• 5. Strong English communication skills (listening, speaking, reading, and writing) and excellent interpersonal skill.
• 6. Ability to lead projects from beginning to end and drive initiatives with a global team.
• 7. Ability to work under pressure.
• 8. Work location is in Mexico.