W2W Bonding Research Scientist (APM), IME

Agency for Science, Technology and Research (A*STAR); Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading research institution in Singapore is seeking a Research Scientist to develop and optimize advanced hybrid bonding techniques for semiconductor applications. The ideal candidate will have a PhD in Materials Science or a related field, with experience in W2W bonding processes and a strong background in advanced packaging technologies. The position involves leading innovative projects, conducting reliability testing, and mentoring junior staff in this cutting-edge field.

Qualifications

• Strong technical background in semiconductor materials and processes.
• Experience with W2W bonding process preferred.
• Ability to mentor junior staff in advanced technologies.

Responsibilities

• Lead the design and development of innovative W2W bonding techniques.
• Investigate bonding materials to ensure strong interfaces.
• Optimize bonding parameters for high-performance applications.
• Conduct reliability testing on bonded structures.
• Collaborate on technology road mapping and project leadership.

Skills

Process Innovation

Material Science

Parameter Optimization

Problem Solving

Data Analysis

Education

PhD degree in Materials Science or related field

Tools

SEM

SAM

AFM

Job description

Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible fordeveloping, optimizing, and integrating advanced hybrid bonding techniquesfor semiconductor applications like 2.5D and 3D IC packaging.

Job Description

Research and Development

• Process Innovation: Leading the design and development of innovative W2W bonding techniques for applications in high-performance computing, AI, and memory.
• Material Science: Investigating and selecting appropriate bonding materials (e.g., low-temperature organic/inorganic materials, Cu/oxide, Cu/polymer) to ensure strong and stable interfaces.
• Parameter Optimization: Optimizing critical bonding parameters such as temperature, pressure, and surface preparation methods (e.g., CMP, plasma activation, cleaning) to achieve high bonding strength, yield, and alignment accuracy.
• Problem Solving: Addressing challenges related to process integration, such as wafer warpage, thermal budget constraints, contamination, and the reduction of thermo-mechanical stress.

Characterization and Analysis

• Process Evaluation: Coordinating and executing comprehensive evaluations of new processes, materials, and equipment.
• Reliability Testing: Conducting electrical, thermal, and mechanical reliability characterization of bonded structures (e.g., using SEM, SAM, AFM) to validate performance and ensure manufacturing guidelines are met.
• Data Analysis: Utilizing metrology tools and data analysis to assess surface topography, void defects, and bond quality, and driving quality improvements based on these findings.

Collaboration and Strategy

• Project Leadership: Conceiving, planning, and leading high-impact projects, often involving external partners and stakeholders.
• Technology Road mapping: Collaborating with senior staff and process integrators to define and address future technology roadmaps and business challenges in advanced packaging.
• Intellectual Property: Generating detailed reports and contributing to the creation of new intellectual property (IPs) and knowledge areas to strengthen the company;s portfolio.
• Mentorship: Inspiring and mentoring scientists, engineers and technicians in advanced semiconductor technologies.

Job Requirements

• PhD degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in W2W bonding process, with a strong track record in advanced packaging technologies is added advantage.