AOI Senior/Engineer

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

A leading engineering firm in Singapore seeks a quality control engineer. This role involves examining photographic equipment for defects, resolving customer complaints, and initiating improvement projects for quality and cost efficiency. Ideal candidates will hold a degree in Electrical, Electronics, Mechanical or Materials Engineering and have at least three years of relevant experience in wafer bumping or wafer fabrication. Join a dynamic team dedicated to maintaining high standards of quality and performance.

Qualifications

• Degree in relevant engineering field.
• 3 years of relevant experience in wafer bumping or wafer fabrication is an added advantage.

Responsibilities

• Examine photographic equipment for defects to ensure customer quality.
• Review complaints and formulate necessary actions to resolve them.
• Identify causes of defects and recommend corrections.
• Prepare reports on complaint resolutions.
• Initiate quality and cost improvement projects.

Education

Degree in Electrical, Electronics, Mechanical or Materials Engineering or equivalent

Job description

Key Job Accountabilities (Actual daily deliverables):

• Examine photographic pictures and other photographic equipment for defects or faulty operation to determine course of action required to satisfy customer quality
• Review unresolved requests for adjustment of complaints and reads customer comments to determine basis of complaint and plan of action needed to resolve complaint.
• Determine cause of defect and alert process and equipment owners for correction and preventive actions or suggest remedies to prevent subsequent errors in processing.
• Prepare reports indicating complaints handled and dispositions made.
• Suggest and execute improvement projects for quality, cycletime and cost improvement

Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):

• Degree in Electrical, Electronics, Mechanical or Materials Engineering or equivalent
• 3 years of relevant experience in wafer bumping or wafer fabrication an added advantage