Structural à United States

Senior Mechanical Design Engineer page is loaded

Apply locations United Kingdom - Caldicot time type Full time posted on Posted 30+ Days Ago job requisition id R119-25

Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Microchip's Caldicot site is responsible for designing and delivering the next generation of advanced electronic module solutions for global technology markets. Our expertise lies in delivering advanced packaging solutions to our customers where small size and high reliability are critical. Some of our markets include medical, automotive, aerospace, and renewable energy. We develop a wide range of module solutions, ranging from miniaturized implant medical devices to compound semiconductor power modules.

As an Mechanical Design Engineer you will be required to research, design, develop and evaluate new packaging concepts, prototypes and products of the company’s next generation microelectronic modules. This position will allow you to become an integral part of a team of specialists in materials, mechanical, electronics and packaging engineers that strive to push the boundaries of conventional microelectronics packaging.

We are looking for an individual with a passion for exploration and breaking down barriers. If you are a lateral thinker who thrives on challenging the norm, we welcome the opportunity to speak to you.

As a member of our R&D team, you will contribute to the growth and continued success of the company, through the successful development of our next generation products and technology solutions.

We are seeking a skilled Mechanical Design Engineer to contribute to the design and development of RF devices and power modules. This position focuses on the mechanical design, packaging, and thermal management of bare die modules and packages, as well as the development of manufacturing tools to support related production processes.

• Design the mechanical structure, housing, and packaging of RF devices & power modules, ensuring robust performance under thermal and mechanical stress.
• Develop and optimize thermal management solutions such as heat sinks, thermal interfaces, and cooling structures.
• Conduct structural and thermal simulations.
• Create detailed 3D CAD models and engineering drawings.
• Design and develop manufacturing tools, fixtures, and jigs for processes such as die placement, wire bonding, and sintering.
• Collaborate with engineering teams to optimize designs for manufacturability and ease of assembly.
• Evaluate new materials and techniques for module packaging and thermal performance improvements.
• Prepare technical documentation, including CAD drawings, test results, and assembly instructions.
• Take on other engineering duties as required and assigned.
• Travel internationally on occasion as requested.

• Bachelor’s or Master’s degree in Mechanical Engineering, Mechatronics, or a related field.
• 3+ years of experience in mechanical design for electronics packaging or similar industries.
• Proficiency in SolidWorks for 3D modelling and technical drawings.
• Strong knowledge of thermal and structural simulation tools such as ANSYS Mechanical, ANSYS Icepak, or Solidworks Flow.
• Experience in designing manufacturing tools and fixtures for high-precision assembly processes.
• Understanding of materials and processes used in semiconductor packaging, such as wire bonding and die attach.
• Excellent problem-solving skills and attention to detail.
• Strong communication skills and the ability to work in a multidisciplinary team environment.

Travel Time: 0% - 25%

At Microchip, employees are our greatest strength. As one of the top performing semiconductor companies in the world, we are led by a set of guiding values and a mission to become the very best embedded control solutions company ever. We work tirelessly to create a company culture that highlights how important every employee is to our mission.