Senior & Principal Engineer, Process Integration, NAND, NTI

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A global leader in semiconductor solutions is seeking a Senior/Principal NAND Module Process Integration Engineer for their Singapore R&D department. This role involves designing and implementing process solutions to enhance NAND product yield and quality. Candidates must possess a strong background in semiconductor technology, excellent communication skills, and the ability to work collaboratively in cross-functional teams. A BS, MS/PhD in relevant fields is required along with at least 3 years of industry experience.

Qualifications

• Passion in semiconductor technology and innovation.
• Minimum of 3 years of experience in the semiconductor industry.
• Ability to travel for extended periods to the US for collaborative R&D work.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps.
• Develop or redefine CSPEC criteria for optimal product performance.
• Coordinate activities at the manufacturing site to secure funding for experiments.

Skills

Data analysis

Problem-solving

Process integration optimization

Communication skills

Collaboration

Education

BS, MS/PhD in Electrical Engineering or related field

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

• Passion in semiconductor technology and innovation
• Adept at data analysis, problem-solving, and process integration optimization
• Excellent communication skills and ability to work in cross-functional teams
• Committed to quality, collaboration, and continuous improvement
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment
• Ability to travel for extended periods to the US for collaborative R&D work

Requirements:

• BS, MS/PhD in Electrical Engineering, Microelectronics, CHemical Engineering, Material Science or a related field
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.