Senior MTS, Advanced Packaging Integration

Applied Materials; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A global technology leader located in Singapore is seeking an experienced Advanced Packaging Integration Engineer. The role entails developing innovative engineering solutions within advanced panel-level packaging. The ideal candidate will possess expertise in thin film deposition techniques and have significant experience in semiconductor packaging technologies. Collaborative teamwork is essential, as you'll work closely with various teams to ensure successful technology transfer and meet customer requirements. The company offers a comprehensive support system for career growth and development.

Benefits

Supportive work culture

Career growth opportunities

Health and wellbeing programs

Qualifications

• 15 years experience with Bachelor's, 10 years with Master's, or 5 years with PhD.
• Expertise in thin film deposition and panel packaging.
• Strong understanding of semiconductor packaging technologies.

Responsibilities

• Define and implement process flows for advanced packaging.
• Drive material selection and compatibility studies.
• Collaborate with design, reliability, and materials teams.

Skills

Thin film deposition techniques

Panel packaging process integration

Excellent problem-solving skills

Communication skills

Education

Bachelor’s degree in Electrical Engineering, Materials Science, Chemical Engineering, or related field

Tools

Physical Vapor Deposition (PVD)

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Electrochemical Deposition (ECD)

Job description

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits (https://hrportal.ehr.com/applied/).

About the Role

We are seeking a highly skilled Advanced Packaging Integration Engineer to join the Applied Materials Advanced Packaging Disruptive Technology team. This role focuses on advanced advanced packaging process integration, with a focus on thin film deposition and etching techniques towards driving innovation and ensuring seamless integration across manufacturing processes. This technical staff position leads and/or develops and executes exceptionally complex technology and engineering projects and leads research and development of new technologies as appropriate.

Key Responsibilities

Advanced Packaging Process Development

• Define and implement process flows for panel-level packaging and other advanced panel technologies.

• Drive material selection and compatibility studies for large-format form factors.

• Keeps abreast of new developments in own and related technology groups. Participates in publishing at ET conferences and journals.

• Develop innovative solutions as part of proven track record of significant technology contributions. Recognized internally (across Business Units) as one of the limited number of technical experts in their field of expertise.

• Conceive and implement new technology, normally named as primary inventor on numerous critical patents and recognized through awards and/or published papers within the last five years.

• Leads and collaborates to contribute to the development of new principles and concepts. Guides less experienced engineers in utilizing techniques to define methods and new technologies and apply them on unusually complex systems. Involved in judging the approach and verifying the validity of technical strategies.

Functional Knowledge

• Optimize thin film deposition techniques such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) (Including PECVD for low‑temperature applications), Atomic Layer Deposition (ALD) for atomic‑scale control and high‑k dielectrics.

• Electrochemical Deposition (ECD): For metal layers in advanced packaging.

Cross-Functional Collaboration

• Works with business unit in technology development and transfer to customers including customized process development. Plans unit process sequence based on customer requirements. Negotiates process specifications and service offerings with customers. Takes ownership of delivering the required solution to the customers that meets specification.

• Serves as the customer expert across a broad range of products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.

• Work closely with design, reliability, and materials teams to ensure manufacturability and performance.

• Support technology transfer from development to high-volume manufacturing.

• Provides oversight of customer demos, including defining demo conditions and analyzing results.

Data Analysis and Continuous Improvement

• Analyze process data for trend identification and optimization.

• Drive continuous improvement initiatives for unit level process and cycle time improvement.

• Conduct root cause analysis for defects and implement corrective actions to improve yield and reliability.

• Within safety guidelines design, perform, collect data, analyze and compile reports on unusually complex engineering experiments and provides solutions which are highly innovative and ingenious.

Requirements

• Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field.

• Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration.

• Experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP), substrate technology and wafer Back-end technology.

• Knowledge of industry standards and best practices in semiconductor packaging.

• Strong understanding of semiconductor packaging technologies and process flows.

• Strong knowledge of process characterization and troubleshooting.

• Excellent problem-solving skills and ability to work in a fast-paced environment.

• Ability to work in a cleanroom environment.

• Excellent communication skills.

Work Location

• Science Park II (Moving to Tampines in end 2026)

Additional Information

Time Type

Full time

Employee Type

Assignee / Regular

Travel

Yes, 20% of the Time

Relocation Eligible

Yes

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.