Research Engineer (Heterogeneous Integration), (IME)

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading research institute in Singapore is seeking a skilled Research Engineer to drive innovative developments in advanced wafer level packaging processes. Ideal candidates will hold a Master’s or Bachelor’s degree in a relevant field, possess hands-on R&D experience in semiconductor technologies, and are passionate about groundbreaking advancements in microelectronics. Join a team that values collaboration and creativity in pushing the boundaries of technology.

Qualifications

• Hands-on experience in process development or packaging R&D.
• Proven track record in advanced packaging technologies.

Responsibilities

• Lead the design and development of advanced assembly processes.
• Plan and execute evaluations of processes, equipment, and materials.
• Collaborate with project leaders to enhance capabilities.
• Prepare engineering reports and contribute to IP development.
• Engage with stakeholders to address future demands.

Skills

Process development

Advanced packaging technologies

Client engagement

Team collaboration

Education

Master’s or Bachelor’s degree in Materials Science or related field

Job description

About IME

The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics, essential for the next generation of heterogeneous chiplet integration. At IME, you'll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.

Position Overview

We are seeking a highly skilled and motivated Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Requirements

• Educational Background: Master’s or Bachelor’s degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience: Hands-on experience in process development or packaging R&D. A proven track record in advanced packaging technologies will be an added advantage.

Key Responsibilities

• Innovative Process Development: Lead the design and development of advanced assembly processes, including 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
• Evaluation and Characterization: Plan, coordinate, and execute comprehensive evaluations of processes, equipment, and materials. Drive the development of new process qualifications and establish manufacturing guidelines.
• Project Collaboration: Partner with project leaders to align on requirements and enhance capabilities to meet evolving project needs.
• Intellectual Property and Reporting: Prepare detailed engineering reports and contribute to the development of new intellectual properties (IPs) and knowledge areas (KHs), strengthening the IP portfolio in heterogeneous integration.
• Customer and Market Engagement: Engage with internal and external stakeholders to anticipate future demands and develop the capabilities required to address them.