MTS/ Engineer, Process & NPD

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 60,000 - 85,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Member of Technical Staff/Engineer to lead process integration and development for production processes. The ideal candidate will have a Bachelor's degree and at least 3 years of hands-on experience in wafer-level packaging or LCD production lines. Responsibilities include establishing production specifications, troubleshooting issues, and driving zero-defect initiatives, along with mentoring junior engineers. This role offers an opportunity to work within a dynamic team focused on innovation and quality.

Qualifications

• At least 3 years of hands-on process experience in Wafer-level Fanout packaging production line or LCD/FPD production line.
• Knowledge in SPC, DOE, FMEA, and 8D reports is essential.

Responsibilities

• Lead the integration of processes, sampling plans, and defectivity root causes.
• Establish and update production specifications and workflows.
• Troubleshoot process issues, driving improvements in capability and yield.
• Drive zero-defect initiatives with cross-functional teams.

Skills

Process engineering

Process control engineering

Yield enhancement

SPC

DOE

FMEA

8D reports

Education

Bachelor’s degree or Diploma in Chemicals, Materials Science, microelectronics, mechanical engineering or relevant engineering field

Job description

Position Summary

The Member of Technical Staff/ Engineer (Process & NPD) is responsible for integration, development and establishment of production processes.

Responsibilities

• Lead in the integration of processes, sampling plans, OCAP and defectivity root causes between areas
• Participate in machine buy‑off, set up pilot‑line processes, and transition processes into mass production.
• Establish, review, and update production specifications, workflows, and quality/safety documentation.
• Troubleshoot process issues and drive improvements in capability, yield, and cycle time from NPI to LVM/HVM.
• Sustain process performance through SPC monitoring, FDC alerts, defect Pareto analysis, and continuous parameter optimization.
• Drive zero‑defect initiatives by maintaining and updating FMEA, Control Plans, and OCAPs with cross‑functional teams.
• Coordinate with vendors/suppliers on process and quality issues; support customer NPI and internal engineering activities.
• Lead development and qualification of new materials, processes, and equipment; conduct process characterization to establish baselines.
• Manage customer audits, provide 8D responses, and disposition engineering/production lots.
• Support automation integration (MES/FDC/EAP) and ensure smooth R&D‑to‑production transitions.

Additional responsibilities for MTS:

• Lead and oversee the engineering team within the assigned process area.
• Provide training, mentoring, and technical guidance to junior engineers.
• Serve as the primary technical contact for process‑related matters.

Requirements

• Bachelor’s degree or Diploma in Chemicals, Materials Science, microelectronics, mechanical engineering or relevant engineering field.
• At least 3 years hands‑on process experience in area of in the Wafer‑level Fanout packaging production line or LCD/FPD production line.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Experience in SPC, DOE, FEMA, and 8D reports.