Engineer PE Design Validation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

A global semiconductor company in Singapore seeks a Design Validation Product Engineer to develop next-generation High Bandwidth Memory (HBM) products. The selected candidate will play a key role in product validation through hardware debugging and data analysis. Essential qualifications include a degree in Electrical or Computer Engineering and strong problem-solving skills. This position offers an inclusive environment and exposure to groundbreaking technologies, catering to candidates eager for technical growth.

Qualifications

• Bachelor's degree or MS in Electrical or Computer Engineering.
• Experience in schematic, simulation, data analysis, lab debug, or pattern manipulation.
• Excellent problem-solving and analytical skills.
• Ability to work effectively in a team.

Responsibilities

• Understand JEDEC specifications for HBM and create internal architecture documentation.
• Validate HBM designs through hardware and software debugging and data analysis.
• Communicate and collaborate with the PE team and multi-functional teams.

Skills

Understanding JEDEC specifications for HBM

Communication and collaboration

Problem-solving and analytical skills

Teamwork

Education

Bachelor's degree or MS in Electrical or Computer Engineering

Tools

Schematic

Simulation

Data Analysis

Lab Debug

Pattern Manipulation

Job description

For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring‑up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education.

In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end‑to‑end groundbreaking front‑end and back‑end processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high‑speed signal transmission. Furthermore, "high bandwidth" is an outstanding memory design area where custom gate‑level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate‑level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.

Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural teams across worldwide geographies! Enabling the creative career path you deserve with a collaborative environment, and groundbreaking technology while rapidly growing your abilities.

(Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world‑class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity.

What’s Encouraged Daily:

• Your job duties will include understanding the JEDEC specifications for HBM, understanding and creating internal architecture documentation, and schematic & layout knowledge of our designs.
• You will validate our HBM designs and tackle problems through hardware and software debugging in the lab, circuit simulations, and data analysis.
• Communication and collaboration with your PE team as well as other multi‑functional teams will be crucial to your success.

How To Qualify:

• Bachelor's degree or MS in Electrical or Computer Engineering
• Schematic, Simulation, Data Analysis, Lab Debug, or Pattern Manipulation experience
• Productive and efficient time usage thereby leading to more effective work.
• Excellent problem‑solving and analytical skills
• The ability to work in a team environment

What Sets You Apart:

• Coursework in VLSI, semiconductor process, Python and C/C++
• Experience with either: Verilog, VHDL, or System Verilog
• Having an innovative approach that is open to improving upon any of our procedures or products.
• Self‑motivation and passion
• Satisfactory ability to convey or share ideas either verbally or in written form.