Engineer, Advanced Packaging Die Level Technology Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

A global leader in memory and storage solutions is seeking a professional to develop and optimize assembly processes, ensuring quality improvements in the semiconductor industry. The ideal candidate will hold an engineering degree, possess strong analytical skills, and have experience with data analytics tools such as Python and SQL. Join a culture committed to innovation and collaboration in Singapore.

Qualifications

• Bachelor's or advanced degree in Engineering or Science is required.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator, able to collaborate across all levels.
• Growth mindset with a passion for continuous learning.
• Demonstrated leadership and a track record of impact are highly desirable.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Work closely with internal and external stakeholders to build and execute technology development strategies.
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production facilities.

Skills

Analytical skills

Communication skills

Critical thinking

Growth mindset

Knowledge of semiconductor industry

Education

Bachelor's or advanced degree in Engineering or Science

Tools

Python

R

SQL

Visual Basic

Job description

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.

Overview

Key responsibilities and duties include:

Process Development

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Establish and improve process management projects to deliver technology node requirements.

Equipment and Materials

• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for a variety of semiconductor equipment.
• Evaluate, promote, and plan for new equipment and materials.

Quality Improvement

• Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.

Collaboration and Coordination

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives.
• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.
• Ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities.

Qualifications

• Bachelor’s or advanced degree in Engineering or Science is required.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator, able to collaborate across all levels.
• Growth mindset with a passion for continuous learning.
• Internship or experience in the semiconductor industry is a plus.
• Demonstrated leadership and a track record of impact are highly desirable.
• Interest in and knowledge of the semiconductor industry and Micron is preferred.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.
• Experience with Visual Basic for automation and tool integration is preferred.

Core Values

• People – Respect, develop, and empower others
• Innovation – Drive continuous improvement and breakthrough thinking
• Tenacity – Show grit and determination
• Collaboration – Build trust and foster teamwork
• Customer Focus – Deliver excellence and value

What to Expect

Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor.

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.