Senior IC Package Design Engineer - Cadence APD/SIP Expert

Technical Futures. Careers; Remote; GBP 80,000 - 100,000; Full time

Job summary

A thriving High Technology firm is seeking an experienced IC Package Design Engineer to lead package design activities. This role requires expertise in Cadence APD/SIP, RLC parasitic extraction, and knowledge of packaging technologies. The ideal candidate will have 5+ years of relevant experience and an Electronic Engineering degree. A highly competitive salary package is offered, with possibilities for remote work from the UK, Switzerland, or Taiwan.

Qualifications

• Proven top level Package design and RLC parasitic extraction.
• 5+ years in IC Package design using Cadence APD / SIP.
• Using Cadence (Virtuoso / Extract IM / Power DC) / Ansys / SQW Tools (SiWave / Q3D).
• Using AutoCAD tool.
• Knowledge of various IC Packaging technology.
• Electronic Engineering related Degree qualification.
• A basic understanding of Thermal and mechanical behaviour of IC Packages.

Responsibilities

• Undertake all package design activities.
• Ensure cost effective methodologies are incorporated.
• Complete verification of electrical characteristics of the package.
• Provide support to Assembly related activities.

Skills

Proven top level Package design and RLC parasitic extraction

5+ years in IC Package design using Cadence APD / SIP

Using Cadence (Virtuoso / Extract IM / Power DC) / Ansys / SQW Tools (SiWave / Q3D)

Using AutoCAD tool

Knowledge of various IC Packaging technology

Electronic Engineering related Degree qualification

A basic understanding of Thermal and mechanical behaviour of IC Packages

Education

Electronic Engineering related Degree qualification

Tools

Cadence APD

Cadence (Virtuoso / Extract IM / Power DC)

Ansys

SQW Tools (SiWave / Q3D)

AutoCAD

Job description

A thriving High Technology firm is seeking an experienced IC Package Design Engineer to lead package design activities. This role requires expertise in Cadence APD/SIP, RLC parasitic extraction, and knowledge of packaging technologies. The ideal candidate will have 5+ years of relevant experience and an Electronic Engineering degree. A highly competitive salary package is offered, with possibilities for remote work from the UK, Switzerland, or Taiwan.