Master Thesis: FE modeling and experimental validation for porosity evaluation in copper sintering

Fraunhofer-Gesellschaft; Chemnitz; Vor Ort; EUR 40.000 - 60.000; Vollzeit

Zusammenfassung

A leading research institute is seeking a motivated Master's student for a thesis project focusing on copper sintering in packaging technologies. You will conduct experiments, develop simulation models, and document findings. Proficient German or English skills are required, along with enrollment in relevant engineering programs. This role offers access to state-of-the-art facilities and flexible working hours.

Leistungen

Flexible working hours

Access to state-of-the-art lab facilities

Support from a motivated research team

Qualifikationen

• Enrolled in a relevant Master’s program.
• Basic knowledge of materials characterization and/or simulation tools.
• Very good proficiency in German or English.
• Independent and structured working style.
• Average grade of < 2.

Aufgaben

• Conduct a literature review on copper sintering.
• Select and prepare suitable copper pastes for study.
• Perform sintering experiments using a press.
• Characterize sintered samples for porosity and bond properties.
• Develop simulation models for porosity evolution.
• Validate simulation results with experimental data.
• Document results and compile the thesis report.

Kenntnisse

Materials characterization

Simulation tools (e.g. COMSOL)

Experimental lab work

Proficiency in German or English

Ausbildung

Master’s program in Microsystems Engineering

Master’s program in Materials Science

Master’s program in Electrical Engineering

Master’s program in Mechanical Engineering

Jobbeschreibung

The department System Packaging focuses on innovative packaging technologies for microelectronics and power electronics. The main emphasis lies on the development of reliable interconnection and bonding techniques that meet increasing demands in thermal and mechanical stability. In the context of electromobility and other high- tech applications, we investigate new approaches for using copper as a cost-efficient and high-performance material in packaging solutions.

With the continuous advancement of power electronics, the demand for innovative packaging technologies that ensure high thermal and mechanical reliability is rapidly increasing. One of the strongest driving forces behind this trend is the electric vehicle (EV) industry, where efficient, robust, and cost-effective packaging solutions are essential for next-generation devices.

Traditionally, silver-based sintering pastes state of the art for die / substrate-attach materials. However, copper has recently emerged as a promising alternative due to its lower cost, high availability, and excellent electrical and thermal properties. Despite these advantages, copper sintering presents significant challenges. Porosity of copper pastes critically influences the thermal conductivity, electrical conductivity and the mechanical stability of the joint, making its evaluation and control a key challenge for industrial adoption.

This thesis project will focus on investigating the porosity evolution in different copper pastes after sintering and its influence on the properties of the sintered interface. The work will involve conducting sintering experiments using a sintering press with selected copper pastes, followed by detailed characterization of the resulting interfaces in terms of porosity, thermal and mechanical integrity. In parallel, simulation models will be developed to describe and predict porosity formation and evolution after the sintering process.

We are looking for a motivated and committed student to take on this exciting Master’s thesis project and contribute to shaping the future of power electronics packaging.

What you will do

• Conduct a literature review on copper sintering and porosity evaluation methods.
• Select and prepare suitable copper pastes for experimental study.
• Perform sintering experiments using a sintering press under defined conditions.
• Characterize sintered samples to quantify porosity and bond properties.
• Develop simulation models to describe porosity evolution after sintering.
• Validate simulation results with experimental data.
• Correlate process parameters, porosity, and joint performance.
• Document results and compile the thesis report.

What you bring to the table

• You are enrolled in a Master’s program in Microsystems Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related fields.
• You are studying in Chemnitz, Mittweida or the surrounding area.
• You have basic knowledge of materials characterization and / or simulation tools (e.g. COMSOL).
• You are interested in experimental lab work.
• You have very good proficiency in German or English (spoken and written).
• You have an independent and structured working style.
• An average grade of < 2 completes your profile.

What you can expect

• You will work in an interdisciplinary and motivated research team.
• You will get access to state-of-the-art laboratory and simulation facilities.
• You will gain practical insights into current challenges in power electronics and packaging technologies.
• You will have flexible working hours and close supervision throughout the thesis.
• You will benefit from a collegial, pleasant and motivating working environment.

We value and promote the diversity of our employees' skills and therefore welcome all applications — regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability.

With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.

Interested? Apply online now. Please attach your certificates and a current overview of your grades to your application.

We look forward to getting to know you!

Please address any questions you may have to
Michaela Baum
E-mail: [e-mail]

For data protection reasons, we can only consider applications via our career portal - thank you.

Fraunhofer Institute for Electronic Nano Systems ENAS
www.enas.fraunhofer.de